2016
DOI: 10.1007/s40194-016-0381-1
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Low temperature joining of copper by Ag nanopaste: correlation of mechanical properties and process parameters

Abstract: Nanoparticles exhibit a decrease in sintering and melting temperature with decreasing particle size in comparison to the corresponding bulk material. After melting or sintering of the nanoparticles, the material behaves like the bulk material. Therefore, high-strength and temperatureresistant joints can be produced at low temperatures, which is of big interest for various joining tasks. Joints (substrate: Cu) were prepared with an Ag nanoparticle-containing paste. The influence of the adjustable process parame… Show more

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Cited by 25 publications
(17 citation statements)
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“…After melting and sintering of the particles, the material behaves like the bulk material (Gibbs-Thomson effect) [31,32]. Thus, high-strength and temperature-resistant joints can be produced at low temperatures, which is of great interest for various joining tasks.…”
Section: Low Temperature Joining Of Copper Using Ag Nanoparticles Andmentioning
confidence: 99%
See 4 more Smart Citations
“…After melting and sintering of the particles, the material behaves like the bulk material (Gibbs-Thomson effect) [31,32]. Thus, high-strength and temperature-resistant joints can be produced at low temperatures, which is of great interest for various joining tasks.…”
Section: Low Temperature Joining Of Copper Using Ag Nanoparticles Andmentioning
confidence: 99%
“…The strength behavior as a function of the mentioned parameters and other process parameters like heating rate, thickness of paste application, surface pre-treatments of the substrates, a pre--drying process and a subsequent heat treatment are investigated [31]. For joining with nanoparticles, the nanoparticles are suspended in solvents and through the addition of dispersing agents surrounded with an organic shell [31,32]. This shell leads to repulsive forces between the particles, so that agglomerations can be avoided [42,43].…”
Section: Low Temperature Joining Of Copper Using Ag Nanoparticles Andmentioning
confidence: 99%
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