Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems

Selbmann, Franz; Baum, Mario; Meinecke, Christoph; Wiemer, Maik; Kühn, Harald; Joseph, Yvonne

doi:10.1149/2162-8777/ac12b6

Cited by 10 publications

(17 citation statements)

References 28 publications

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“…The non-patterned waferwafer bonding is prone to external local defects. These results are similar to results reported earlier by other groups [21,24] The mechanical strength of the parylene-parylene bond interface was investigated by determining the tensile and shear strength using a universal test machine (H5K5, Tinius Olsen), as shown in figures 7(c) and (d). Both sides of the bonded wafer were glued to a wooden specimen using Araldite epoxy resin.…”

Section: Parylene-parylene Bondingsupporting

confidence: 86%

“…An alternate process may be envisaged where the recrystallization may be done during bonding itself instead of prior to the bonding. Prior work [21] on the parylene-parylene utilized bonding at 260 • C for a near-hermetic bond. To compare our method with the previously reported results, paryleneparylene bonding done at 260 • C was used as the alternative.…”

Section: Recrystallization Of the Parylenementioning

confidence: 99%

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Wafer level hermetic bonding and packaging using recrystallized parylene

Maharshi¹,

Ahmad²,

Agarwal³

et al. 2022

J. Micromech. Microeng.

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This work reports a wafer-level vacuum packaging technique for MEMS using recrystallized parylene material as a bonding layer. The effect of thermal annealing on the crystallinity of the parylene surface was demonstrated. The low-temperature, stable, homogeneous, and defect-free recrystallized parylene is found as an excellent bonding material for hermetic packages, suitable for the packaging of MEMS sensors. The material's recrystallization improves its capabilities as a moisture and air barrier. The mechanical stability of the bond interface was also investigated by measuring the package's tensile and shear strength. In the absence of a vacuum bonding tool, a Ti getter was integrated into the cavity of the glass capping wafer to create the vacuum and test the hermeticity. The MEMS silicon Pirani gauge was used to monitor the pressure changes inside the sealed cavity. After the getter activation, it was observed that there was a decrease in the pressure from atmospheric pressure to 0.2 mbar for the first few days; after that, no noticeable change was observed. The hermeticity of the packaged device was examined, and the vacuum level inside the package remained the same for the last 70 days. The recrystallized parylene bonded micro package shows better hermeticity than the non-recrystallized parylene micro package.

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Section: Parylene-parylene Bondingsupporting

confidence: 86%

Section: Recrystallization Of the Parylenementioning

confidence: 99%

Wafer level hermetic bonding and packaging using recrystallized parylene

Maharshi¹,

Ahmad²,

Agarwal³

et al. 2022

J. Micromech. Microeng.

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“…50−52 In addition, parylene C can be produced as uniform films with thicknesses in the submicrometer range by room-temperature chemical vapor deposition. 53,54 Silicon is a typical material in MEMS/NEMS processes due to its toughness and reliability 55 and has a Young's modulus of 169 GPa. 56 In addition, silicon oxide, polysilicon, and silicon nitride can be fabricated more uniformly than polymeric materials.…”

Section: Membrane-based Mems/nems Biosensors Based On Static Mode Tra...mentioning

confidence: 99%

Membrane-Based NEMS/MEMS Biosensors

Stapf,

Selbmann,

Joseph

et al. 2024

ACS Appl. Electron. Mater.

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Membrane-based nano/microelectromechanical system (NEMS/MEMS) biosensors offer sustainable, costeffective, ultraminiaturized and easy-to-use analytical techniques for various applications, especially in the environmental and biomedical/pharmaceutical fields. Compared to cantilever-based MEMS/NEMS biosensors, membrane-based MEMS/NEMS biosensors have higher sensitivity, especially for liquid samples, as the back of the membrane is not in contact with the analyte solution, resulting in a higher signal-to-noise ratio. This review provides deep insight into the fundamentals, membrane materials, different biosensing designs, as well as various transducers used in membrane-based MEMS/NEMS biosensors. The performance of the developed membrane-based MEMS/NEMS biosensors is critically discussed, and their trends and challenges are highlighted. Among the reported biosensors, capacitive-based surface stress biosensors and capacitive micromachined ultrasonic transducer (CMUT) biosensors are emerging as sophisticated and sensitive platforms for biosensing with the ability to detect multiple targets simultaneously. Nevertheless, challenges remain in biosensor design, parameter optimization, and selection of appropriate membrane materials. Further research is imperative to improve the capabilities of these biosensors, particularly in advancing array technologies for the simultaneous detection of multiple analytes.

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“…Parylene in general is primarily used as a sealing coating since it has great barrier properties. There are a lot of research papers to be found on parylene C, which is also the most used parylene type in the electronics industry [9][10][11][12][13][14][15][16]. On the other hand, a much lower number of papers are to be found on the parylene type AF4 (aliphatic fluorinate-4), which, especially in comparison to the other parylene types, stands out due to its high thermal stability (up to 550 • C) [17].…”

Section: Introductionmentioning

confidence: 99%

Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy

2023

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Advanced packaging solutions require insulation and passivation materials with exceptional properties which can also fulfill the reliability needs of electronics devices such as MEMS, sensors or power modules. Since bonding (cohesive/adhesive) properties of packaging coatings are very important for reliable functioning of electronics devices, the bonding of aliphatic fluorinate-4 (AF4) parylene coatings was assessed in this work. As there is a lack of data regarding its bonding towards different substrates, pull-off tests of 1.6 and 2.5 µm thick AF4 coatings on silicon (Si) and glass (SiO2) substrates were performed. These showed a clear difference in the pull-off F/s curves between the AF4 coatings on Si and SiO2 substrates. This difference is parameterized by the pull-off energy, which will be presented in this work. To further understand the origin of the distinction in the pull-off energies between the AF4-Si and AF4-SiO2 samples and subsequently the cohesive/adhesive properties, mechanical and structural characterization was conducted on the AF4 coatings, where a clear difference in the E-modulus and crystallinity was observed. The Si and SiO2 wafers were shown to facilitate the CVD growth of the AF4 film distinctively, which likely relates to the divergent thermal properties of the substrates. Understanding of the cohesive/adhesive properties of AF4 coatings on different substrate materials advances the usage of the AF4 in electronics packaging technologies.

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Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems

Cited by 10 publications

References 28 publications

Wafer level hermetic bonding and packaging using recrystallized parylene

Wafer level hermetic bonding and packaging using recrystallized parylene

Membrane-Based NEMS/MEMS Biosensors

Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy

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