Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects – A novel approach for hybrid metal baseplates

Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform

“…Further, challenges that reduce the reliability have not been overcome yet. [15][16][17] Therefore, the joint structure needs to be improved to strengthen the toughness of the joint.…”

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging

“…Intermetallic compounds (IMCs), which possess high MP, for example, Cu 6 Sn 5 (415 °C) and Cu 3 Sn (676 °C), have been widely investigated in the reaction between the Cu substrate and tin-based solders. − Recently, full-IMC joints, which can be formed at low temperature but can be serviced at high temperature, have been considered to overcome the above-mentioned technological challenges. The full-Cu 6 Sn 5 or full-Cu 3 Sn IMC joints are usually fabricated by eutectic bonding, transient liquid phase (TLP) bonding, and solid–liquid interdiffusion (SLID) bonding technologies. − However, the above bonding techniques may require longer times (for example 120 min, 180 min, and 960 min) to form a thermodynamically stable full-IMC joint. Moreover, long time exposure of the microelectronic devices to high temperature will cause reliability problems.…”

“…The full-Cu 6 Sn 5 or full-Cu 3 Sn IMC joints are usually fabricated by eutectic bonding, transient liquid phase (TLP) bonding, and solid−liquid interdiffusion (SLID) bonding technologies. 15−19 However, the above bonding techniques may require longer times (for example 120 min, 17 180 min, 18 and 960 min 14 ) to form a thermodynamically stable full-IMC joint. Moreover, long time exposure of the microelectronic devices to high temperature will cause reliability problems.…”