Vertical cavity surface emitting laser (VCSEL) diodes fabricated with inverted polarity, i.e. p-type bottom mirror and n-type top mirror, are reported with lower resistance and diode voltage and comparable output characteristics relative to similar conventional, non-inverted structures.Most laser diodes are fabricated on n-doped substrates with ndoped material below the active region and p-doped material above it. However, both circuit and device performance considerations for arrays of vertical cavity surface emitting lasers (VCSELs) motivate inverting this polarity so that the substrate and lower epitaxial layers are p-doped and the upper epitaxial layers are ndoped. From a circuit perspective, this latter configuration allows simple fabrication of common anode laser arrays that can be driven with open collector npn transistors which typically perform better than pnp transistors.While consideration of n-doped and p-doped mirror properties suggests that p-substrate VCSELs should perform better than their n-substrate counterparts [1], such experimental results have not been reported. Results from external cavity VCSELs based on psubstrates have been published [2] but are not readily compared with purely monolithic structures. A more recent report of similar VCSELs with both types of substrates indicated that the performance of the p-substrate devices lagged that of the n-substrate devices [3]. Here, we report state-of-the-art, oxide-confined, p-substrate VCSELs with characteristics equal to or better than comparable n-substrate devices.Material issues including the stability of dopants and the quality of substrates may have limited previous efforts to realise p-substrate VCSELs. Some p-type dopants such as zinc and beryllium are more diffusive or prone to surface segregation [4] than silicon, the most common n-type dopant. These properties can result in the movement of significant dopant concentrations from underlying material into the active region, reducing optical efficiency. This problem is enhanced in thick VCSEL structures with high aluminum content that require long growths at high temperatures. In general, p-type and semi-insulating substrates also have higher concentrations of defects than n-type substrates. Previous attempts at Sandia to realise p-substrate VCSELs using molecular beam epitaxy with beryllium doping have been unsuccessful. The structures presented here were produced with metalorganic chemical vapour deposition using CCI 4 as the source for carbon as a low diffusivity, more readily incorporated p-type dopant. A constant growth temperature of 750°C was used throughout the structures, except for the heavily doped contact layers. Decreasing the growth temperature in the active region could lead to enhanced carbon incorporation from any residual CCI 4 and was thus avoided [5]. The substrates were produced by vertical gradient freeze and had doping concentrations of 3 x 10 18 /= 3 of zinc or 2 x 10 18 /cm 3 of silicon. The etch pit density of the p-substrates was 5000/= 2 • Lasers made on two ...