2020
DOI: 10.1108/ssmt-11-2019-0041
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Low-voiding solder pastes in LED assembly

Abstract: Purpose This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes. Design/methodology/approach The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. T… Show more

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Cited by 7 publications
(1 citation statement)
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“…Many papers describe different scientific problems connected with the manufacturing, testing, modelling and technical applications of power LEDs [5][6][7][8]. In the last 10 years, the maximum value of the emitted luminous flux and the value of luminous efficiency have visibly increased [3,9,10].…”
Section: Introductionmentioning
confidence: 99%
“…Many papers describe different scientific problems connected with the manufacturing, testing, modelling and technical applications of power LEDs [5][6][7][8]. In the last 10 years, the maximum value of the emitted luminous flux and the value of luminous efficiency have visibly increased [3,9,10].…”
Section: Introductionmentioning
confidence: 99%