“…Generally, materials, such as III–V compounds, conventional bulk lithium niobate (LN), and silicon, have already been widely used to fabricate commercial modulators. However, because of intrinsic nonlinearity, high cost, and the limitation of traditional waveguide fabrication techniques, neither III–V compounds nor bulk LN-based EOMs can meet the large-scale integration and low-cost requirements for the next-generation optical communication systems. − Thanks to the matured complementary metal-oxide-semiconductor (CMOS) fabrication process, silicon has become a major photonics platform but with the highest 3-dB E-O bandwidth only around 60 GHz due to the physical limitation of a free carrier dispersion effect. , Nowadays, with the success of manufacturing thin-film lithium niobate (TFLN) and its breakthroughs in nanofabrication techniques, − the TFLN platform offers new possibilities for high-performance integrated nanophotonic systems. Therefore, EOMs based on the Pockels effect in TFLN have already outperformed their counterparts realized in traditional platforms. , …”