&lt;i&gt;In-situ&lt;/i&gt; Tensile Tester for Scanning Three-Dimensional X-ray Diffraction Microscopy

Hayashi, Yukimasa; Setoyama, Daigo; Kimura, Hidehiko; Yoneyama, Yusuke; Takeuchi, Kazuhiko

doi:10.2355/isijinternational.isijint-2022-358

ISIJ Int.

2023

DOI: 10.2355/isijinternational.isijint-2022-358

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<i>In-situ</i> Tensile Tester for Scanning Three-Dimensional X-ray Diffraction Microscopy

Yukimasa Hayashi

Daigo Setoyama

Hidehiko Kimura

et al.

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2024

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Non-destructive orientation mapping of die-attach lead-free solder

Hayashi,

Kimura

2024

Appl. Phys. Express

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Thermo-mechanical fatigue poses a serious challenge to the electrical operation of power semiconductor modules, manifested by the degradation of die-attach lead-free solder. So far, orientation microscopy (OM) using electron backscatter diffraction is considered a sensitive approach to characterizing the degradation of solder. However, its destructive character inhibits assessing solder inside power modules. We propose a non-destructive OM method based on X-ray diffraction and successfully observed the changes in the orientation of solder caused by thermo-mechanical fatigue. The proposed non-destructive OM method can facilitate the development of reliable power modules by evaluating the degradation of solder inside power modules.

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Non-destructive orientation mapping of die-attach lead-free solder

Hayashi,

Kimura

2024

Appl. Phys. Express

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<i>In-situ</i> Tensile Tester for Scanning Three-Dimensional X-ray Diffraction Microscopy

Cited by 1 publication

References 54 publications

Non-destructive orientation mapping of die-attach lead-free solder

Non-destructive orientation mapping of die-attach lead-free solder

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