2018
DOI: 10.1109/led.2018.2871221
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<inline-formula> <tex-math notation="LaTeX">${L}_{{g}} = {87}$ </tex-math> </inline-formula>nm InAlAs/InGaAs High-Electron- Mobility Transistors With a <italic>g</italic> m_max of 3 S/mm and <inline-formula> <tex-math notation="LaTeX">$f_{{T}}$ </tex-math> </inline-formula> of 559 GHz

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Cited by 29 publications
(10 citation statements)
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“…As a result, it is imperative to boost both f T and f max in a harmonious way, since this enables a wide variation of applications such as low-noise-amplifiers (LNAs) and various THz integrated circuits using a single device technology. [9][10][11][12][13][14][15][16] In our previous report, 17) we demonstrated a significant potential of using an indium-rich channel design with Hall mobility close to 13 000 cm 2 V −1 s −1 , which resulted in outstanding DC and high-frequency characteristics with L g = 87 nm InGaAs HEMTs. In this paper, we demonstrate aggressively scaled down InGaAs/InAlAs HEMTs on a 3 inch InP substrate with both f T and f max in excess of 700 GHz at the same bias condition.…”
mentioning
confidence: 90%
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“…As a result, it is imperative to boost both f T and f max in a harmonious way, since this enables a wide variation of applications such as low-noise-amplifiers (LNAs) and various THz integrated circuits using a single device technology. [9][10][11][12][13][14][15][16] In our previous report, 17) we demonstrated a significant potential of using an indium-rich channel design with Hall mobility close to 13 000 cm 2 V −1 s −1 , which resulted in outstanding DC and high-frequency characteristics with L g = 87 nm InGaAs HEMTs. In this paper, we demonstrate aggressively scaled down InGaAs/InAlAs HEMTs on a 3 inch InP substrate with both f T and f max in excess of 700 GHz at the same bias condition.…”
mentioning
confidence: 90%
“…The device fabrication was nearly the same as in previous report from our group. 17) This is a two-step recess process with a gate-to-channel distance, t ins , of approximately 5 nm. Source-to-drain spacing (L SD ) was scaled down to 0.8 μm, and a non-alloyed metal stack of Ti/Mo/Ti/Pt/Au (5/10/10/ 10/200 nm) was used to form S/D ohmic contact.…”
mentioning
confidence: 99%
“…InAlAs/InGaAs heterostructures have been widely studied in various aspects because of their vast potentials in both ultrahigh-speed electronic devices and highly-efficient optoelectronic devices that can operate in the infrared regimes. For instance, the high electron-mobility transistors [1][2][3][4] and the spin field-effect transistors [5] are feasible electronic devices that could be demonstrated on InAlAs/InGaAs heterostructures. In addition, the infrared photodetectors [6][7][8][9], X-ray detectors [10], terahertz (THz) quantumcascade lasers [11,12], mid-infrared quantum-cascade lasers [13,14], and electro-optical modulators [15] are also typical examples that can open up a broad avenue toward the tangible optoelectronic applications of the InAlAs/InGaAs quantum well (QW) structures.…”
Section: Introductionmentioning
confidence: 99%
“…parasitics plays a key role [3]- [5], as does the improvement of transport properties in the 2-D electron gas. InAs insets in indium-rich GaInAs channels evolved toward larger conduction band offsets and better carrier confinement [6].…”
Section: Introductionmentioning
confidence: 99%