<title>Failure analysis of advanced packaging technologies using scanning acoustic microscopy</title>

Abstract

In recent years, scanning acoustic microscopy(SAM) has been found to be a very successful technique when used in the microelectromcs mdustry to evaluate, from a reliability perspective, standard plastic packagmg technologies such as PQFP's, PLCCs, DIPs and SOP's [1,2] The recent explosion of advanced packagmg techniques such as Chip-on-Board, Flip-chip and BGA and the proliferation of Microsystems has further widened the arena of what constitutes microelectronics With such a wide breadth of devices from standard plastic packages to state-of-the-art microsystems, it is difficult to find a failure analysis technique which can cope competently with that scope. SAM is one such technique [3,4,5]. This paper will demonstrate the effectiveness of SAM at non-destructively analysmg a range of advanced packagmg technologies from integrated passives to flip-chip to microsystems.

Application of C-mode Scanning Acoustic Microscopy in Packaging

“…It can provide images at bond interfaces, non-destructive cross sectional views, 3 dimensional internal views, through-transmission images, bulk material analysis, and it can be programmed to obtain data images on an automated basis for various components or devices located in trays or on boards. [1][2][3][4][5][6][7][8][9][10][11] This paper will demonstrate the effectiveness of C-SAM at non-destructively analysis from A-Scan, B-Scan, C-Scan and T-Scan respectively. And the capability of C-SAM in detecting IC surface corrosion will be also illustrated.…”