<title>High-intensity laser processing of thin films</title>

Abstract

We use high intensity nanosecond laser pulses of different wavelengths to modify thin-film coatings (silica and titania) on the surface of silicon. We find that films as thick as 1 micron can be removed from the surface in one shot with minor or no damage to the Si surface. We also find the accumulated effect of multiple pulse irradiation. Finally we report our preliminary results on phase transformations in titania films induced by high intensity laser.

<title>Modification of thin metal and ceramic films by UV and IR laser radiation</title>

“…Laser ablation of thin film on various substrates, using excimer lasers with different wavelengths, radiation energy density and pulse duration, have been intensively studied within recent several years [1][2][3][4][5]. That may be related to the possibility of such technology application in production of printed circuit cards possessing high packing density, photolithography shields, etc.…”