1998
DOI: 10.1117/12.302397
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<title>Optical measurement of LIGA milliengine performance</title>

Abstract: Understanding the parameters that affect the performance of milliscale and microscale actuators is essential to the development of optimized designs and fabrication processes, as well as the qualification of devices for commercial applications. This paper discusses the development of optical techniques for motion measurements of LIGA fabricated milliengines. LIGA processing permits the fabrication of precision millimeter-sized machine elements that cannot be fabricated by conventional miniature machining techn… Show more

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Cited by 6 publications
(2 citation statements)
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“…Its main drawback is the inability to determine the phase relationship between measurements of different points [32]. Many monitoring schemes applied to MEMS use optical methods that provide low noise and high accuracy metrology, but these bulk optical systems are employed only during dielevel testing prior to device packaging [33]. Electrical means for sensing device motion during device operation have been explored [19], however, the dynamic range of the signal associated with device movement is small compared with the drive voltage signal.…”
Section: Integrated Through Wafer Monitoring Methodsmentioning
confidence: 99%
“…Its main drawback is the inability to determine the phase relationship between measurements of different points [32]. Many monitoring schemes applied to MEMS use optical methods that provide low noise and high accuracy metrology, but these bulk optical systems are employed only during dielevel testing prior to device packaging [33]. Electrical means for sensing device motion during device operation have been explored [19], however, the dynamic range of the signal associated with device movement is small compared with the drive voltage signal.…”
Section: Integrated Through Wafer Monitoring Methodsmentioning
confidence: 99%
“…As discussed earlier, many MEMS monitoring schemes use bulk optical methods that provide low noise and high accuracy metrology. However, these are employed only during die-level testing prior to device packaging [32]. Electrical means of sensing device motion during device operation have been explored.…”
Section: Integrated Optical Monitoring and Control Explorationmentioning
confidence: 99%