&lt;title&gt;Problems of high-efficiency holographic beamsplitters&lt;/title&gt;

Mikaelian, Andrei L.; Kiselyov, Boris S.; Palagushkin, A. N.; Prokopenko, Sergei A.; Shkitin, Vladimir A.

doi:10.1117/12.274433

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“…At 0.532 tm the transmittance ofthe resist-coated sample is 93.5 %, which is quite acceptable for most applications. In our experiments we use an e-beam mashine built around the electron scanning microscope ZRM-20 Carl Zeiss " and a special image generator [2,3]. The machine provides the exposure-controlled vector scan of 2Ox2O-im to lxl-mm samples with addressing as many as 16000 points in each coordinate.…”

Section: Fabrication Of Binary Elementsmentioning

confidence: 99%

“…According to the computations, the most critical requirement in achieving the smallest variation of output beam intensities is the exactness of the phase relief depth [2,3]. The depth value should be accurate to im over the whole beamsplitter aperture to provide the intensity variations of no greater than Actually, the average departure of the relief depth from the computed value should not exceed tim.…”

Section: Introductionmentioning

confidence: 99%

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Fabrication of multilevel HOEs using direct e-beam writing

Palagushkin¹,

Politov²,

Prokopenko³

et al. 1998

SPIE Proceedings

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The paper describes the method of HOE fabrication using direct exposure-controlled e-beam writing of binary and multilevel phase reliefs in a resist layer. Beamsplitters with diffraction efficiency of over 70 % have been made using this technique. INTRODUCTIONThe computer simulation gives the relationship between beamsplitter performance parameters and the necessary fabrication accuracy [1]. According to the computations, the most critical requirement in achieving the smallest variation of output beam intensities is the exactness of the phase relief depth [2,3]. The depth value should be accurate to im over the whole beamsplitter aperture to provide the intensity variations of no greater than Actually, the average departure of the relief depth from the computed value should not exceed tim. FABRICATION OF BINARY ELEMENTS.The substrates we use are 25x25 mm thermostable glass plates 1.5 mm thick. The plate surface roughness Rz is 0.05, and the flatness is no greater than half an interference ring. An anti-reflection MgF2 layer is evaporated on one of the plate surfaces. An electron-sensitive resist layer is centrifugally deposited on the other. The resist is dried in a infrared dryer. We apply a short-term increase of temperature at the end of the dry to make the resist surface smoother. Fig. 1 gives the transmission spectra of an uncoated glass substrate (1), one-sidedly coated substrate (2), and the substrate with a resist layer (3). At 0.532 tm the transmittance ofthe resist-coated sample is 93.5 %, which is quite acceptable for most applications. T%-----% 92 91 90 89 87 86 -ii --

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Section: Fabrication Of Binary Elementsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%