&lt;title&gt;Processing applications with the 157-nm fluorine excimer laser&lt;/title&gt;

Herman, Peter R.; Beckley, K.; Jackson, Brian E.; Kurosawa, Kou; Moore, David; Yamanishi, Takayuki; Yang, Jianhao M.

doi:10.1117/12.270086

Cited by 36 publications

(19 citation statements)

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“…Herman et al reported F, (l57nm) laser ablation of fused silica for the high-quality surface patterning [1]. Varel et al reported high-quality channel drilling of fused silica by fs laser ablation [2].…”

Section: Introductionmentioning

confidence: 98%

<title>Novel technology for laser precision microfabrication of hard materials</title>

Sugioka

Midorikawa

2000

SPIE Proceedings

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Hybrid laser processing for precision microfabrication of hard materials, in which interaction of a conventional pulsed laser beam and another medium on the material surface leads to effective ablation, is reviewed. The main role of the medium is to produce strong absorption of the ns-laser beam to the materials. Simultaneous irradiation of the UV laser beam with the VUV laser beam possessing extremely small laser fluence performs accurate ablation of the hard materials such as fused silica, crystal quartz, sapphire, GaN, SiC, etc. (VUV-UV multiwavelength excitation process). Metal plasma generated by the laser beam effectively assists high-quality ablation of transparent materials, leading to submicron grating fabrication and high-speed hole drilling of glass materials (laser-induced plasma-assisted ablation (LIPAA)). The detailed discussion includes ablation mechanism of hybrid laser processing and comparison of advantages and disadvantages with F2 laser ablation.

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Section: Introductionmentioning

confidence: 98%

<title>Novel technology for laser precision microfabrication of hard materials</title>

Sugioka

Midorikawa

2000

SPIE Proceedings

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“…However, due to the wide-band-gap (9.0 eV) and the large bond-strength (9.3 eV) only "big photon" from l57nm-laser (7.9 eV) or "multi-photon" from fs-laser (100-200 fs) is qualified to realize the high-quality and high-efficiency micro-machining of fused silica. A quite few papers are already published about this [2][3][4] Since ns-lasers with the wavelengths from infrared (IR) to ultraviolet (UV) provide high pulse energy and are commercial available we need to expand our option to the micro-machining of fused silica by use of IR, visible or UV ns-laser. Therefore, a novel ablation technique of hybrid-laser-ablation was recently developed.…”

Section: Introductionmentioning

confidence: 99%

Microprocessing of glass materials by laser-induced plasma-assisted ablation using nanosecond pulsed lasers

2000

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In this paper, we demonstrate formation of micro-grating in fused silica by laser-induced plasma assisted-ablation (LIPAA) using different wavelength lasers projected through a metallic mask. With becoming longer wavelengths from 266, 532 to lO6Onm, the ablation rate of fused silica at l.5J/cm2 decreases from 21, 2 to 0mm/pulse. While the ablation threshold of laser fluence increases from 0.7, 1 .5 to 3.75J/cm2. The 2.0mm deep through holes in Pyrex glass are drilled by single-beam 532nm-laser ablation. While the same deep through holes in fused quartz are only drilled by double-pulse-train of 532nm-laser ablation with a time-delay of 3.3ns. Finally, the ablation process was analyzed by an in-situ observation of laserproduced plasma, revealing different natures for surface patterning and channel-drilling.

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“…There is also promise in using the VUV laser for processing glasses [3] and, indeed, some success in micromachining glass by ablation has been reported [4] . In contrast, there appears to be only one brief mention of fibre Bragg grating (FBG) inscription at 157 nm [1] , even though it is expected that photo-physical and photo-chemical mechanisms responsible for glass refractive index modification [5] will be strong at this wavelength. The extension of FBG studies to the VUV is of interest because higher photosensitivity could of lead to more efficient fabrication through reducing exposure times and also allow inscription in fibres that have intrinsically low photosensitivity.…”

Section: Introductionmentioning

confidence: 99%

“…This, together with a sub-micron spatial resolution capability, suggests that laser ablation in the VUV may become increasingly more important for some specialized manufacturing routes in optoelectronics. For example, VUV laser ablation has been used to fabricate sub-micron period relief gratings [1] and micro mesas [2] in polymethylmethacrylate (PMMA), a material that has importance in low-cost photonic devices. There is also promise in using the VUV laser for processing glasses [3] and, indeed, some success in micromachining glass by ablation has been reported [4] .…”

Section: Introductionmentioning

confidence: 99%

F 2 -laser applications for machining optoelectronic microstructures

Dyer¹,

Johnson²,

Maswadi³

et al. 2003

SPIE Proceedings

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We report studies of material processing using the VUV F 2 laser which, by virtue of its low threshold, high resolution 'machining' capability, may bring advantage to laser-based optoelectronic and photonic device fabrication. For example, probe beam deflection and etch rate studies of polymethylmethacrylate (PMMA) show this has a low ablation threshold, F T =20mJcm -2 , and a large effective absorption coefficient, 1.6 ×10 5 cm -1 , at 157nm, permitting high-resolution etching at modest fluence. The smooth ablated surfaces and low degree of thermal damage obtained with this laser make it well suited to machining structures such as relief gratings in PMMA. We also describe new results on producing fibre Bragg gratings with the 157nm laser. It is shown that these gratings can be written in a non-sensitised single mode fibre (Corning HI 980) with a low fluence and low total dose.

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<title>Processing applications with the 157-nm fluorine excimer laser</title>

Cited by 36 publications

References 0 publications

<title>Novel technology for laser precision microfabrication of hard materials</title>

<title>Novel technology for laser precision microfabrication of hard materials</title>

Microprocessing of glass materials by laser-induced plasma-assisted ablation using nanosecond pulsed lasers

F 2 -laser applications for machining optoelectronic microstructures

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