&lt;title&gt;Reliability of packaged MEMS in shock environment: crack and striction modeling&lt;/title&gt;

Millet, Olivier; Collard, Dominique; Buchaillot, L.

doi:10.1117/12.462874

Cited by 16 publications

(12 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Other researchers modeled the shock problem of MEMS using lumped spring-mass-damper models, such as Srikar and Senturia [18], Li and Shemansky [6], Qian et al [19], Coster et al [20], Bao et al [21], Khatami and Rezazadeh [22], and Ghisi et al [23]. Also, a number of studies accounted for the flexibility of microstructures and treated them as distributed parameters systems in analytical models including the works of Tas et al [24], Fang et al [25], Yee et al [26], and Millet et al [27].…”

Section: Introductionmentioning

confidence: 98%

Mechanical Shock in MEMS

Younis

2011

Microsystems

View full text Add to dashboard Cite

This chapter addresses a reliability issue of MEMS that is crucial for their commercialization, which is their survivability under mechanical shocks. Unlike conventional electronics of passive elements, MEMS contain flexible components that are deliberately designed to undergo some kind of motion. Thus, a natural question comes of how these microstructures respond when they are subjected to dynamic shock loads? What about short circuit and stiction when they make contacts with the substrate or stationary electrodes due to shock loads? These are some of the issues that are treated in this chapter. In addition, the impact of electrostatic forces on the dynamic response is illustrated. The interaction of the motion of microstructures with the printed circuit boards where they are mounted on is also discussed. IntroductionWith the rapid growth and maturity of the MEMS technology, many device concepts are ready to make the transition from research labs to consumer products. One of the critical issues affecting the commercialization of MEMS devices is their reliability and survivability under mechanical shock and impact. Several MEMS components have already made it to the market and being increasingly integrated and embedded into handheld devices and consumer products, such as the interactive motion-sensitive video games and smart phones. In such environments, there is an obvious need to ensure the durability and reliability of MEMS to sustain the various dynamic loads while being used by consumers.MEMS generally can be exposed to shock during fabrication, deployment, shipping, and operation. Also, a crucial criterion for automotive and industrial applications is the survivability of portable devices containing MEMS when dropped on hard surfaces, which can induce significant shock loads. For some applications, MEMS are expected to survive sever dynamic loading, such as the harsh environments in military applications. In addition, aerospace applications rely on pyrotechnic devices, which generate dangerous shock waves of amplitude reaching hundreds of thousands of gs. MEMS sensors and devices in these applications are required to survive such severe environments.

show abstract

Section: Introductionmentioning

confidence: 98%

Mechanical Shock in MEMS

Younis

2011

Microsystems

View full text Add to dashboard Cite

show abstract

“…Xiao et al Given that shock leads microstructure to hit the stationary plate, particularly during fabrication, it would be described as an applied force over a short D DAVID PUBLISHING Force, and Mechanical Shock 83 period of time [11,12]. On the other hand, it is undeniable that bending stresses result from shock acceleration in silicon or polysilicon fabricated MEMS [13].…”

Section: Introductionmentioning

confidence: 99%

“…Likewise, the virtual work done by axial residual force and pressure effect is (11) (12) where, P is the pressure. In accord with the principle of minimum total potential energy, one can be obtained as (13) By substitution of Eqs. (9)- (12) into Eq.…”

mentioning

confidence: 99%

Modeling and Analysis of Electrostatically Actuated MEMS under Combined Nonlinearities, Lorentz Force, and Mechanical Shock

Ghiasi¹

2016

JCSE

View full text Add to dashboard Cite

This paper shows an analysis of M EM S (micro electro mechanical systems) due to Lorentz force and mechanical shock. The formulation is based on a modified couple stress theory, the von Kármán geometric nonlinearity and Reynolds equation as well. The model contains a silicon microbeam, which is encircled by a stationary plate. The non-dimensional governing equations and associated boundary conditions are then solved iteratively through the Galerkin weighted method. The results show that pull-in voltage is dependent on the geometry nonlinearity. It is also demonstrated that by increasing voltage between the silicon microbeam and stationary plate, the pull-in instability happens.

show abstract

“…Thus, understanding the interaction of mechanical shock, electrostatic forces, and the motion of PCB with that of microstructures is necessary to ensure safe and reliable operation ofMEMS devices. A number of investigations have been conducted in recent years to investigate mechanical shock in MEMS [1][2][3][4][5][6][7][8][9]. Comprehensive reviews of these can be found in [10][11][12][13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Modeling the effects of the PCB motion on the response of microstructures under mechanical shock

Ramini

Younis

Miles

2010

2010 11th International Thermal, Mechanical &Amp; Multi-Physics Simulation, and Experiments in Microelectronics and Microsystem

View full text Add to dashboard Cite

Microelectomechanical systems (MEMS) are often used in portable electronic products that can be subjected to mechanical shock or impact due to being dropped accidentally. This work presents a modeling and simulation effort to investigate the effect of the vibration of a printed circuit board (PCB) on the dynamics of MEMS microstructures when subjected to shock. Two models are presented. In the first approach, the PCB is modeled as an Euler-Bernoulli beam to which a lumped model of a MEMS device is attached. In the second approach, a special case of a cantilever microbeam is modeled as a distributedparameter system, which is attached to the PCB. These lumped-distributed and distributed-distributed models are solved numerically by integration of the equation of motion over time using the Galerkin procedure. Results of the two models are compared against each other for the case of a cantilever microbeam and also compared to the predictions of a finite-element model using ANSYS. The influence of the higher order vibration modes of the PCB, the location of the MEMS device on the PCB, the electrostatic forces, damping, and shock pulse duration are presented. It is found that neglecting the effects of the higher order modes of the PCB and the location of the MEMS device can cause incorrect predictions of the response of the microstructure and may lead to failure of the MEMS device. It is observed from the results that in some cases, depending on the different parameters of the problem, the response of the microstructure can be amplified causing early dynamic pull-in and hence possibly failure ofthe device.

show abstract

<title>Reliability of packaged MEMS in shock environment: crack and striction modeling</title>

Cited by 16 publications

References 3 publications

Mechanical Shock in MEMS

Mechanical Shock in MEMS

Modeling and Analysis of Electrostatically Actuated MEMS under Combined Nonlinearities, Lorentz Force, and Mechanical Shock

Modeling the effects of the PCB motion on the response of microstructures under mechanical shock

Contact Info

Product

Resources

About