&lt;title&gt;Unique MEMS characterization solutions enabled by laser Doppler vibrometer measurements&lt;/title&gt;

Speller, Kevin E.; Goldberg, Howard; Gannon, Jeff; Lawrence, Eric M.

doi:10.1117/12.468197

Cited by 12 publications

(3 citation statements)

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“…For dynamic characterization of MEMS, Doppler interferometry, optical microscopic interferometry, digital holography and electronic speckle pattern interferometry have been developed to achieve its full-field out-of-plane measurements [4][5][6]. Petitgrand applied novel time-averaging interferometry using a quantitative analysis of the interference fringe contrast for detection of the vibratory mode and shape [7].…”

Section: Introductionmentioning

confidence: 99%

Dynamic out-of-plane profilometry for nano-scale full-field characterization of MEMS using stroboscopic interferometry with novel signal deconvolution algorithm

Chen

Huang

Nguyen

et al. 2009

Optics and Lasers in Engineering

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Section: Introductionmentioning

confidence: 99%

Dynamic out-of-plane profilometry for nano-scale full-field characterization of MEMS using stroboscopic interferometry with novel signal deconvolution algorithm

Chen

Huang

Nguyen

et al. 2009

Optics and Lasers in Engineering

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“…In recent years, many methods have been developed for measuring the vibratory modes of micromechanical devices, such as MEMS and MOEMS with fiber optic interferometry [3,4] or single-beam laser Doppler vibrometers [5]. A major disadvantage of these techniques is that its point-type measurement requires lateral scanning, which is extremely time consuming.…”

Section: Introductionmentioning

confidence: 99%

Theoretical simulation and experimental confirmation of duty cycle effect on stroboscopic white light interferometry for M(O)EMS dynamic characterization

Chen

Tapilouw

2013

J. Micromech. Microeng.

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Stroboscopic white light interferometry (SWLI) has been known as a useful measurement technique for vibrating samples such as micro-electro-mechanical systems (MEMS) or micro-opto-electro-mechanical systems (M(O)EMS) because it enables dynamic mode reconstruction and characterization of the tested system. An approximate model simulation without any experimental confirmation previously indicated that the duty cycle of the light could reduce the accuracy of the measurement. To provide a comprehensive insight into this important phenomenon, the study investigated theoretically and experimentally the effect of duty cycle of the light. An atomic force microscopy cantilever beam vibrating at its second resonant frequency was measured and the experimental measurements were analyzed and compared with the simulated results. In general, a reasonable correspondence between the mathematical model and the experimental measurements has been observed when the duty cycle is less than 15% and the average deviation is kept within 15.4% of the vibration amplitude. However, it is verified that the SWLI using white light LED has its physical detection limits when the cycle time of the strobed light or the light exposure time of the imaging device is more than 20%, in which the maximum measured error can significantly exceed 38.4% of the vibration amplitude.

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“…The information provided by the testing will not only augment the theoretical model, but also provide feedback in understanding the effect of the micromachining process. MEMS are, by definition, coupled electro-mechanical structures and as such it is often difficult to determine the mechanical response because of the coupled electro-mechanical behavior [4]. In this regard, the experimental investigation carried out in this paper consists of testing several microcantilever structures under varying thermal loads, hence obtaining a thermo-mechanical profile of a particular microstructure under different thermal strains.…”

Section: Introductionmentioning

confidence: 99%

Boundary characterization of microstructures through thermo-mechanical testing

Rinaldi¹,

Packirisamy²,

Stiharu³

2006

J. Micromech. Microeng.

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A variety of silicon foundry processes available for microsystem implementation are available at the present time. The manufacturing methods and the associated process tolerances employed at a particular foundry will determine the performance of the finished devices. Moreover, micro-electro-mechanical systems (MEMS) often require processes that are difficult to control. Device-to-device variations can occur even in batch microfabricated systems. One particular limitation of MEMS foundry processes, in general, is associated with non-classical boundary support conditions due to over/under etching of silicon. These non-classical support conditions will affect the static and dynamic performance of the microsystem. This condition has important implications in atomic force microscopy applications where the targeted natural frequencies are given a wide tolerance due in large part to microfabrication limitations. This paper presents the boundary characterization of single crystal silicon microcantilevers through thermo-mechanical testing. A non-contact optical sensing approach is used for the experimentation. The Rayleigh–Ritz energy method incorporating boundary characteristic orthogonal polynomials is used for the prediction analysis.

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<title>Unique MEMS characterization solutions enabled by laser Doppler vibrometer measurements</title>

Cited by 12 publications

References 0 publications

Dynamic out-of-plane profilometry for nano-scale full-field characterization of MEMS using stroboscopic interferometry with novel signal deconvolution algorithm

Dynamic out-of-plane profilometry for nano-scale full-field characterization of MEMS using stroboscopic interferometry with novel signal deconvolution algorithm

Theoretical simulation and experimental confirmation of duty cycle effect on stroboscopic white light interferometry for M(O)EMS dynamic characterization

Boundary characterization of microstructures through thermo-mechanical testing

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