2000
DOI: 10.1117/12.395655
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<title>UV-LIGA microfabrication and test of an ac-type micropump based on the magnetohydrodynamic (MHD) principle</title>

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Cited by 13 publications
(6 citation statements)
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“…In a typical setup, see Figure 13, a uniform magnetic field of strength B creates a controllable force (Lorentz force) F as a driving source in the flow for control and manipulation [114][115][116][117][118][119]. MHD (micro)pump can be fully described by a combination of Navier-Stokes equations of fluid dynamics and Maxwell's equations of electromagnetism.…”
Section: Mhd (Micro)pumpsmentioning
confidence: 99%
“…In a typical setup, see Figure 13, a uniform magnetic field of strength B creates a controllable force (Lorentz force) F as a driving source in the flow for control and manipulation [114][115][116][117][118][119]. MHD (micro)pump can be fully described by a combination of Navier-Stokes equations of fluid dynamics and Maxwell's equations of electromagnetism.…”
Section: Mhd (Micro)pumpsmentioning
confidence: 99%
“…The flow rates vary from 6,010 ll/min for the nozzle/diffuser micropump of Heng et al (1999) to 0.002 pl/min of Bao and Harrison (2003). Both AC and DC sources have been used (Bendib and Français 1999;Heng et al 2000;Heschel et al 1997;Huang et al 1999Huang et al , 2000. With regard to micromachining processes, bulk micromachining of silicon using LIGA, inductively coupled plasma reactive ion etching (ICP-RIE), and anisotropic wet etching together with soft lithography have been used.…”
Section: Introductionmentioning
confidence: 99%
“…They can be used to fabricate microstructures of metals and alloys on the order of hundreds, or thousands of micrometers in thickness with high precision. Various microstructures and microdevices have been fabricated using the technology (Konaka and Allen 1996;Kim and Allen 1998;Park and Allen 1999;Hang et al 2000;Liu et al 2001). Typical microsystems utilizing thick layers of metal or alloys include microrelays for power applications and electromagnetic microactuators (Yang et al 2003;Williams and Wang 2004a).…”
Section: Introductionmentioning
confidence: 99%