&lt;title&gt;Wafer scale packaging for a MEMS video scanner&lt;/title&gt;

Helsel, Mark P.; Barger, Jon D.; Wine, David W.; Osborn, Thor D.

doi:10.1117/12.425304

Cited by 4 publications

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The bonding is done by using glass frit or by anodic bond created by electrical potential. Precision-aligned wafer bonding is the key technology for high-volume, low-cost packaging of MEMS devices (Helsel et al, 2001;. State-of-the-art silicon wafer bonding can provide assembly level packaging solutions for many MEMS devices.…”

Section: Wafer-level Packagingmentioning

confidence: 99%

Micromachined Antennas

2002

RF MEMS and Their Applications

View full text Add to dashboard Cite

Printed and bound in Great Britain by Biddles Ltd, Guildford and King's Lynn This book is printed on acid-free paper responsibly manufactured from sustainable forestry in which at least two trees are planted for each one used for paper production.xii PREFACE fabrication technologies can help realize high Q micromechanical filters for frequencies up to and beyond 10 MHz, and micromachined surface acoustic wave (SAW) filters filling the gap up to 2 GHz. Fabrication processes for all these devices and their relative advantages are taken up extensively in this book. In addition, a brief description of packaging approaches that may be extended for these devices is also included for the sake of comprehensiveness in coverage.We have endeavoured to present these topics so as to guide graduate students interested to do research in microfabrication techniques and their applications. It is therefore envisaged that parts of this books would form the curricula of electrical and mechanical engineering, applied physics or materials science departments. In addition, this would also serve as a reference book for practicing researchers in these areas for further widening the scope of their research.Materials for this book have been taken from an advanced level course offered at Pennsylvania State University recently on RF MEMS, and many short courses presented across the world. Valuable comments from the participants of these courses have helped in evolving the contents of this book and are greatly appreciated. In particular we also wish to thank many of our colleagues and students, Taeksoo Ji, Yanan Sha, Roopa Tellakula, Hargsoon Yoon, and Bei Zhu, at the Center for Electronic and Acoustic Materials and Devices for their contributions in preparing the manuscript for this book.We would like to thank Professors Vasundara V. Varadan and Richard McNitt for their support and encouragement. Our thanks are also due to our families, in particular Nisy John, for bearing with our preoccupation in preparing this manuscript. We are also indebted to various researchers for their valuable contributions cited in this book.We are also grateful to the publisher's staff for their support, encouragement and willingness to give prompt assistance during this book project.

show abstract

Section: Wafer-level Packagingmentioning

confidence: 99%

Micromachined Antennas

2002

RF MEMS and Their Applications

View full text Add to dashboard Cite

show abstract

Determination of residual stress in glass frit bonded MEMS by finite element analysis

Ebert

Bagdahn

2004

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. E

View full text Add to dashboard Cite

Glass frit bonding is an universal technique with intermediate glass layer for the packaging of Micro-Electro-Mechanical Systems (MEMS). The joining of two wafers is required to protect surfaced micro-machined structures during fabrication and use. The object of this paper is to investigate numerically the influence of the bonding process on the generated residual stress in the glass frit layer of a typical chip. The residual stresses are caused by different coefficients of thermal expansion of the frit glass and the silicon wafer. A determination of the stress level is required, since the residual stress can influence the properties of the capped micro-machined structures and also the long-term reliability of the bond frame. A parameterized Finite Element (FE) model of a typical chip structure was developed which consists of a silicon device wafer, the glass frit layer and a silicon cap wafer with a cavity. Frame width and thickness of the glass, also called seal glass were varied. It was shown, that significant stresses (a bout 100MPa) occur in the plane of seal glass in cause of cooling after bonding. The influence of bond pressure is rather small. The residual stresses have to consider if further mechanical stresses are investigated. So a tension test normal to the seal glass plane was superposed with the residual stresses. The location of maximum stresses could be shown and it was in agreement with experimental results

show abstract

Biaxial MEMS raster scanner with linear ramp drive

Ürey

Sprague²

2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682)

View full text Add to dashboard Cite

A biaxial MEMS raster scanner is developed for laser scanning displays. We discuss microfabrication, packaging, and design aspects, and how to minimize power consumption and linearity error by optimizing the vertical scanner resonant frequency and drive waveform.Introduction: Integration of MEMS scanner and diode light sources (e.g: laser diodes, LEDs) provide a-powerfUl combination for display and imaging applications. Scanner requirements depend on the system resolution, number of light sources used, and the raster scan architecture. A typical SVGA display system requires +/-6deg mechanical scan angle, and 60Hz and 20 KHz

show abstract

<title>Wafer scale packaging for a MEMS video scanner</title>

Cited by 4 publications

References 5 publications

Micromachined Antennas

Micromachined Antennas

Determination of residual stress in glass frit bonded MEMS by finite element analysis

Biaxial MEMS raster scanner with linear ramp drive

Contact Info

Product

Resources

About