Luminescent porous silicon prepared by reactive ion etching

Karbassian, F.; Rajabali, Shima; Chimeh, Abbas; Mohajerzadeh, S.; Asl-Soleimani, Ebrahim

doi:10.1088/0022-3727/47/38/385103

Cited by 13 publications

(9 citation statements)

References 38 publications

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“…Q total = Q Excess Carrier + Q sub + Q por (5) Q total characterises the value of all charge carriers involved in the electrooxidation of ethanol. It the case of the present research work, Q total depends on Pd/por-Si contact area.…”

Section: Discussionmentioning

confidence: 99%

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Investigation of the Pd Nanoparticles-Assisted Chemical Etching of Silicon for Ethanol Solution Electrooxidation

et al. 2019

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The formation of porous silicon by Pd nanoparticles-assisted chemical etching of single-crystal Si with resistivity ρ = 0.01 Ω·cm at 25 • C, 50 • C and 75 • C in HF/H 2 O 2 /H 2 O solution was studied. Porous layers of silicon were studied by optical and scanning electron microscopy, and gravimetric analysis. It is shown that por-Si, formed by Pd nanoparticles-assisted chemical etching, has the property of ethanol electrooxidation. The chromatographic analysis of ethanol electrooxidation products on por-Si/Pd shows that the main products are CO 2 , CH 4 , H 2 , CO, O 2 , acetaldehyde (CHO) + , methanol and water vapor. The mass activity of the por-Si/Pd system was investigated by measuring the short-circuit current in ethanol solutions. The influence of the thickness of porous silicon and wafer on the mass activity and the charge measured during ethanol electrooxidation was established. Additionally, the mechanism of charge transport during ethanol electrooxidation was established.

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Section: Discussionmentioning

confidence: 99%

“…The plasma chemical etching for porous silicon formation is widely used. This method is characterised by a high complexity of hardware provided [5]. Chemical etching in solutions of alkalis or acids is a cheaper method for porous Si formation.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Pd Nanoparticles-Assisted Chemical Etching of Silicon for Ethanol Solution Electrooxidation

et al. 2019

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“…Chemically stable mesoporous and macroporous silicon structures can be formed as a result of a maskless sequential reactive-ion etching (RIE) of silicon wafers using H 2 , O 2 , and SF 6 plasma [36]. The sequential process is composed of one etching and two passivation subsequences: oxidation and fluorination, as depicted in Figure 11.…”

Section: Reactive-ion Etchingmentioning

confidence: 99%

“…By proper adjustment of the gases flow rates, plasma powers, durations of the subsequences, and repetition, it is possible to tailor the porosity and thickness of the mesoporous or macroporous material [36]. Since the fabrication process is performed at room temperature, it can be used as a post-fabrication treatment, which is very important in a technological point of view.…”

Section: Reactive-ion Etchingmentioning

confidence: 99%

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Porous Silicon

Karbassian¹

2018

Porosity - Process, Technologies and Applications

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Porous silicon is a sponge-like structure of monocrystalline silicon which although accidentally discovered, soon became one of the most well-researched silicon structures. Its properties and applications have been the main subject of several books and more than a dozen review articles. However, a survey of porous silicon fabrication methods has not been published even though more than 20 different routes have been developed to synthesize this material. This chapter briefly discusses the properties of porous silicon, describes its fabrication methods, and introduces its applications.

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