“…The current issue and full text archive of this journal is available at www.emeraldinsight.com/0260-2288.htm responses. The most common crack inspection methods include dye inspection, eddy current inspection (Zenzinger et al, 2007), acoustic inspection (Hilmersson et al, 2007;Yagi et al, 2007), ultrasonic inspection (Reber and Beller, 2003), radiant heat thermography (RHT) (Pilla et al, 2002;Devitt et al, 1992), scanning acoustic microscopy (SAM) (Knauss et al, 1995;Connor et al, 1998), photoluminescence (PL) (Trupke et al, 2006a, b), electroluminescence (EL) (Takahashi et al, 2006;Dreckschmidt et al, 2007), and resonance ultrasonic vibration (RUV) (Polupan and Ostapenko, 2006;Dallas et al, 2008). It is easy to detect surface cracks by applying deep color dye to the surface of a solar wafer.…”