2004
DOI: 10.1049/ip-map:20040656
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Lumped-distributed hybrids in 3D–MMIC technology

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Cited by 14 publications
(6 citation statements)
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“…Table 2 compares the proposed rat-race coupler with the state-of-the-art on-chip designs in the literature, which includes those on the GaAs substrate [11,12], multilayer BCB process [13], CMOS technology [14] and IPD technology [18]. The proposed IPD coupler, when compared with those using the lossy GaAs/CMOS technologies [13,14], alleviates the parasitic power dissipation whereas still keeping a very compact size. It makes the coupler more attractive in practical applications.…”
Section: Resultsmentioning
confidence: 99%
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“…Table 2 compares the proposed rat-race coupler with the state-of-the-art on-chip designs in the literature, which includes those on the GaAs substrate [11,12], multilayer BCB process [13], CMOS technology [14] and IPD technology [18]. The proposed IPD coupler, when compared with those using the lossy GaAs/CMOS technologies [13,14], alleviates the parasitic power dissipation whereas still keeping a very compact size. It makes the coupler more attractive in practical applications.…”
Section: Resultsmentioning
confidence: 99%
“…On-chip rat-race couplers have also drawn considerable attention because of their capability to integrate with other circuit components monolithically. Based on the popular lumped-distributed approach, on-chip 180°hybrids were reported in [11][12][13] using multilayer benzocyclobuten polymer (BCB)s or Si 3 N 4 on a GaAs substrate. In general, the operating bandwidths of these on-chip couplers are limited to 20-30%.…”
Section: Introductionmentioning
confidence: 99%
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“…In order to reduce the chip area, techniques have been proposed for the quadrature hybrids by using multilayer configurations [1], [2], 3-D technologies [3], and lumped [4]- [7] or lumped-distributed equivalence [8]. However, due to the lack of high-on-chip passive components, most of the miniaturized circuits suffer from high insertion losses, large phase error, and unequal coupling at the thru and coupled port.…”
Section: Introductionmentioning
confidence: 99%
“…One approach used phase inverters to shorten the 3..1/4 section to a length of A./ 4 [186][187][188][189][190]. Another popular approach added lump components to the distributed components to reduce or e liminate certain distributed portions [191][192][193].…”
Section: Introduction Of Rat-race Hybridmentioning
confidence: 99%