Machining characteristics of 65 vol.% SiCp/Al composite in micro-WEDM

Chen, Zhi; Zhou, Hongkang; Yan, Zhaojun; Han, Fenglin; Yan, Hongjie

doi:10.1016/j.ceramint.2021.01.212

Cited by 31 publications

(10 citation statements)

References 38 publications

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“…With the use of the PSO optimization technique, Chen et al [105] suggested a hybrid optimization strategy that increased MRR by a maximum of 49.1% and decreased Ra by a maximum of 37.8% in the micro-WEDM process while machining 65 vol.% SiCp/Al composite. Moreover, the Pareto optimum solution sets, as depicted in Figure 10, had great accuracy and dependability.…”

Section: Parameters Optimizationmentioning

confidence: 99%

Parameters Optimization of Electrical Discharge Machining Process Using Swarm Intelligence: A Review

Chen

et al. 2023

Metals

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Electrical discharge machining (EDM) can use soft tool electrodes to process hard workpieces to achieve “soft against hard”, because it directly uses electrical energy and thermal energy to remove metal materials. Then, it can generate complex features on harder materials and meet the requirements of excellent surface quality. Since EDM involves many process parameters, including electrical parameters, non-electrical parameters, and materials properties, it is essential to optimize its process parameters to obtain good performance. In this direction, the application of the swarm intelligence (SI) technique has become popular. In this paper, the existing literature is comprehensively reviewed, and the application of the SI technique in the optimization of EDM process parameters is summarized. Sinker-EDM (SEDM), wire-EDM (WEDM), and micro-EDM (MEDM) with various hybrid techniques are among the EDM methods considered in this study because of their broad adoption in industrial sections. The fundamental nature of all review articles will assist engineers/workers in determining the process parameters and processing performance, the SI algorithm, and the optimal technique by which to obtain the desired process parameters. In addition, discussions from the perspectives of the similarity, individuality, and complementarity of various SI algorithms are proposed, and necessary outlooks are predicted, which provides references for the high performance of the EDM processes in the future.

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Section: Parameters Optimizationmentioning

confidence: 99%

Parameters Optimization of Electrical Discharge Machining Process Using Swarm Intelligence: A Review

Chen

et al. 2023

Metals

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“…Increase in current and voltage improves the rate of material removal, but increase in pulse‐on time beyond 25 μs causes its declination during electrical discharge machining of silicon carbide‐carbon nanotube ceramic composite [24]. Wire electrical discharge machining of pressure infiltrated silicon carbide – aluminium composites results increase in surface roughness and rate of material removal on elevating the pulse‐on time levels [25]. During electrical discharge machining of powder metallurgy processed aluminium – carbon nanotube (0 wt.…”

Section: Introductionmentioning

confidence: 99%

Machinability and surface morphology investigations of multiwall carbon nanotube reinforced aluminium 7075 metal matrix composite during electrical discharge machining: A grey relational approach

Pradhan,

Tripathy,

Prasad

et al. 2023

Materialwissenschaft Werkst

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Multiwall carbon nanotube buttressed aluminium 7075 metal matrix composite was synthesized through an amended liquid metallurgy method, which consisted semisolid stirring, ultrasonic treatment and squeeze casting. Aim was to investigate its machinability and surface morphology during electrical discharge machining. Variable machining factors were peak current, pulse‐on time and gap voltage, whereas the responses under investigation were electrode wear rate, material removal rate and average surface roughness. Results revealed electrode wear rate, material wear rate and average surface roughness increased on increasing peak current and pulse‐on time, but all these responses behaved inversely with the increase of gap voltage. Average surface roughness reduced by around 44 % on reducing the peak current from 10 A to 4 A and increasing gap voltage from 55 V to 80 V at constant pulse‐on time of 300 μs; however, it increased by around 25 % on reducing the gap voltage from 80 V to 55 V and increasing the pulse‐on time from 100 μs to 300 μs at constant peak current of 10 A. Significance of the process parameters were verified, regression models were developed and morphology of the machined surfaces was studied. Finally, multiple response optimization was conducted following grey relational approach.

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“…SiCp/Al composites are widely used in aerospace, automotive, electronic packaging, and other fields [1][2][3][4][5] due to their high strength, high modulus, and excellent wear resistance. [6][7][8][9] The application demand of SiCp/Al composites with thickness more than 200 mm is increasing.…”

Section: Introductionmentioning

confidence: 99%

Copper Plating on SiCp by Cooling Crystallization and Its Effects on the Spreading and Infiltration of AlSi12 Alloy Melt

et al. 2023

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A new cooling crystallization method is applied to plate copper on SiCp. Cu(NO3)2·3H2O is crystallized on SiCp by decreasing the solution temperature, and is heat‐treated to obtain CuO coating which is finally reduced to copper coating. Based on the optimizing of SiCp content and CuO reduction temperature, the effects of copper plating on SiCp on the spreading and infiltration of AlSi12 alloy melt are studied. The results show that the optimum coating effect is achieved when the SiCp content is 11.63% and the reduction temperature of CuO is 475 °C. The spreading area of AlSi12 alloy melt on the 15 μm copper‐coated SiCp increases by 53.27% compared to the uncoated SiCp when holds at 950 °C for 20 min, indicating that copper plating has a significant improvement on the wettability of AlSi12 melt and SiCp. Additionally, infiltration preparation of copper‐plated SiCp/Al alloy composites is achieved at a pressure of 0.3 MPa, but not under pressureless conditions. The main reason for this is the granular Cu on SiCp cannot form a complete Cu film. Therefore, the formation of complete Cu films on SiCp is presumed to be an important development direction for solving the problem of infiltration preparing ultrathick SiCp/Al composites.

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Machining characteristics of 65 vol.% SiCp/Al composite in micro-WEDM

Cited by 31 publications

References 38 publications

Parameters Optimization of Electrical Discharge Machining Process Using Swarm Intelligence: A Review

Parameters Optimization of Electrical Discharge Machining Process Using Swarm Intelligence: A Review

Machinability and surface morphology investigations of multiwall carbon nanotube reinforced aluminium 7075 metal matrix composite during electrical discharge machining: A grey relational approach

Copper Plating on SiCp by Cooling Crystallization and Its Effects on the Spreading and Infiltration of AlSi12 Alloy Melt

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