Machining metals and silicon with GHz bursts: Surprising tremendous reduction of the specific removal rate for surface texturing applications

Hirsiger, Thomas; Gafner, Markus; Remund, Stefan M.; Chaja, Michalina W.; Urniežius, Aivaras; Butkus, Simas; Neuenschwander, Beat

doi:10.1117/12.2543948

Cited by 25 publications

(14 citation statements)

References 15 publications

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“…Research on the use of short-burst lasers with a broad spectrum of parameters exploded during the recent year, supported by new developments in USP lasers with a considerable variety of burst modes available. The specific material removal rate drops down to less than 10% for the metals and 25% for silicon compared to single pulses when the number of pulses per burst is increased up to 25 pulses with a time separation of 180 ps [107]. However, the specific removal rate for soda-lime glass and sapphire increased by a factor of 2.3 and 6, respectively [108].…”

Section: A High-throughput and Precision Ablation Of Metalsmentioning

confidence: 95%

Ultra-Short Pulse Lasers for Microfabrication: A Review

Račiukaitis

2021

IEEE J. Select. Topics Quantum Electron.

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Ultra-short pulse lasers, generating coherent light pulses with pulse durations in the picosecond and femtosecond range, are becoming popular in precision laser microfabrication. They are benefiting not only from well-predicted laser ablation with the suppressed heat-affected zone but also by opening new processing opportunities, especially in transparent materials, due to enhanced non-linear interaction with the material. In this review, the evolution of various kinds of mode-locked lasers from a scientific toy to a robust industrial tool is reviewed. The utilization benefits of high-average-power, high-pulse-repetition-rate ultra-short pulse laser are closely related to beam shaping and manipulation techniques. Fast beam scanning with galvanometric and polygon scanners as well as multi-beam parallel processing methods were developed. Some hot applications areas are briefly described. The efficient use of photons from ultra-short pulse lasers pushed the development of optimization methods in the ablation process. Efforts toward upscaling the process by increasing the average power of mode-locked lasers made feedback to laser developers, and burst regime became a necessity as well as high-speed beam scanning devices. Unique opportunities of ultra-short pulses are successfully exploited in machining transparent materials, with glass separation being the leading application.

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Section: A High-throughput and Precision Ablation Of Metalsmentioning

confidence: 95%

Ultra-Short Pulse Lasers for Microfabrication: A Review

Račiukaitis

2021

IEEE J. Select. Topics Quantum Electron.

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“…Processing at a fluence value below the single-pulse ablation threshold is characteristic for the GHz-burst regime and proves the outstanding accumulative character of the interaction process [4,5,19]. Indeed, in ablation studies using pulse fluences within the burst exceeding one of the single-pulse ablation thresholds even leads to less efficiency and potentially detrimental effects on the surface quality [8]. We further notice that the hole depth first increases and then saturates at certain values depending on the laser fluence for both materials (figures 3(a) and (b)).…”

Section: Hole Depthmentioning

confidence: 98%

“…With ablation rates on metals and semiconductors exceeding those obtained with single pulses [1][2][3][4][5][6][7] this method has generated significant interest. However, some of the studied laser configurations, notably those with only few pulses within the GHzburst and at pulse fluences above the threshold for singlepulse ablation, showed a disadvantageous behavior in ablation experiments [8,9]. So far, most studies have been realized on metals and silicon and only few on dielectrics which are focused on milling ablation removal rates [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Crack-free high-aspect ratio holes in glasses by top–down percussion drilling with infrared femtosecond laser GHz-bursts

Balage

Lopez

Bonamis

et al. 2022

Int. J. Extrem. Manuf.

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We report novel results on top-down percussion drilling in different glasses with femtosecond laser GHz-bursts. Thanks to this particular regime of light-matter interaction, combining non-linear absorption and thermal cumulative effects, we obtained crack-free holes of aspect ratios exceeding 30 in sodalime and 70 in fused silica. The results are discussed in terms of inner wall morphology, aspect ratio and drilling speed.

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“…In general, it can be concluded that drilling processes are always more efficient than milling processes in this processing regime [135,136], which was explained by different melt flows in those two regimes [133]. Furthermore, the increase in energy specific volume is highly dependent on the time span of the used burst train and increases with longer time spans [22,[136][137][138][139]. Moreover, the used inter-burst delay plays a crucial role.…”

Section: Multi-pulse Bursts With Intra-burst Repetition Rates In the Ghz Rangementioning

confidence: 99%

Review on Experimental and Theoretical Investigations of Ultra-Short Pulsed Laser Ablation of Metals with Burst Pulses

et al. 2021

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Laser processing with ultra-short double pulses has gained attraction since the beginning of the 2000s. In the last decade, pulse bursts consisting of multiple pulses with a delay of several 10 ns and less found their way into the area of micromachining of metals, opening up completely new process regimes and allowing an increase in the structuring rates and surface quality of machined samples. Several physical effects such as shielding or re-deposition of material have led to a new understanding of the related machining strategies and processing regimes. Results of both experimental and numerical investigations are placed into context for different time scales during laser processing. This review is dedicated to the fundamental physical phenomena taking place during burst processing and their respective effects on machining results of metals in the ultra-short pulse regime for delays ranging from several 100 fs to several microseconds. Furthermore, technical applications based on these effects are reviewed.

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Machining metals and silicon with GHz bursts: Surprising tremendous reduction of the specific removal rate for surface texturing applications

Cited by 25 publications

References 15 publications

Ultra-Short Pulse Lasers for Microfabrication: A Review

Ultra-Short Pulse Lasers for Microfabrication: A Review

Crack-free high-aspect ratio holes in glasses by top–down percussion drilling with infrared femtosecond laser GHz-bursts

Review on Experimental and Theoretical Investigations of Ultra-Short Pulsed Laser Ablation of Metals with Burst Pulses

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