Macro and micro-nano machining mechanism for ultrasonic vibration assisted chemical mechanical polishing of sapphire

Zhou, Mufang; Cheng, Yuanyao; Zhong, Min; Xu, Wenhu

doi:10.1016/j.apsusc.2023.158343

Cited by 20 publications

(1 citation statement)

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“…At present, many researchers are exploring how to introduce new processes into sapphire CMP to improve the CMP efficiency of sapphire. Among them, ultrasonic (UV)-assisted CMP is currently the most commonly used technology to assist in improving sapphire CMP [133][134][135][136][137]. For instance, Xu et al employed conventional CMP and an ultrasonic bending vibration (UFV) assisted CMP (UFV-CMP) to polish sapphire substrates under different pressures, respectively (Figure 13A) [134].…”

Section: Introducing Other Polishing Processesmentioning

confidence: 99%

Nanomaterials and Equipment for Chemical–Mechanical Polishing of Single-Crystal Sapphire Wafers

Li,

Fu,

et al. 2023

Coatings

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Single-crystal sapphire (α-Al2O3) has been widely used in semiconductor, optics, communication, national defense, and other fields. Before application, an ultra-smooth surface which is scratch free and subsurface damage free is essential. Furthermore, the sapphire has unique qualities such as significant rigidity and chemical stability, which make it extremely arduous to process. Chemical mechanical polishing (CMP) is recognized as the final process to reduce the roughness and eliminate surface defects of a sapphire surface. In this review, the materials and equipment used for the chemical polishing of a sapphire wafer are summarized, and the surface nanoscale changes of sapphire wafer are reviewed from the angles of regulating polishing-process parameters, composition of polishing slurry including that which is nano-abrasive, a pH regulator, a complexing agent, and other additives, as well as hybrid CMP technologies. The outlook and future applications are also summarized.

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