2004
DOI: 10.1007/s11664-004-0067-0
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Macro-loading effects of electron-cyclotron resonance etched II–VI materials

Abstract: It has been observed in semiconductor processing that the etch rates for materials subjected to an electron-cyclotron resonance (ECR) plasma change with the total sample area. This phenomenon is known as loading. Loading effects can result in pattern definition errors during micromachining. In argon/hydrogen plasmas, designed to etch II-VI materials, loading appears to primarily affect photoresist deterioration. Using an 80% argon-20% hydrogen gas chemistry optimized for HgCdTe, we observe a factor of 2 variat… Show more

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Cited by 7 publications
(11 citation statements)
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“…As discussed in Ref. 15, the II-VI semiconductor area may also cause macroloading changes. The HgCdTe-only sample, shown in Fig.…”
Section: Resultsmentioning
confidence: 95%
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“…As discussed in Ref. 15, the II-VI semiconductor area may also cause macroloading changes. The HgCdTe-only sample, shown in Fig.…”
Section: Resultsmentioning
confidence: 95%
“…15, macroloading exists in noble/hydrogen plasma processing of HgCdTe. The macroloading phenomenon (Fig.…”
Section: Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…More details regarding the ECR etch process to transfer patterns in HgCdTe thin films can be found in the literature. 11 A Bede D1 double crystal x-ray diffractometer (Durham, U.K.) was used to examine bulk microstructural changes in HgCdTe films after deposition and complete etching of a-Si:H resists. Rocking curve full width at half maximum (FWHM) maps were obtained before and after processing.…”
Section: Methodsmentioning
confidence: 99%