Magnetoresistance Effect in Co‐Ag and Co‐Cu Alloy Films Prepared by Electrodeposition

Zaman, H.; Yamada, Akihiro; Fukuda, Hisashi; Ueda, Y.

doi:10.1149/1.1838304

Cited by 82 publications

(45 citation statements)

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“…The granular alloy thin films are immiscible combinations usually prepared by physical deposition methods [2,3]. Recently, electrochemical deposition is widely used to produce multilayered alloys exhibiting GMR [4][5][6][7]. This technique is preferred in low-end applications such as GMR sensors in automotive applications or in microsystems [8,9].…”

Section: Introductionmentioning

confidence: 99%

A study of the electrodeposition of Co–Cu alloys thin films on FTO substrate

Mentar¹

2011

Ionics

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In this work, the early stages and the properties of the electrodeposition process of Co-Cu alloys thin films on a fluorine-doped tin oxide (FTO)-coated conducting glass substrate from a sulfate bath were investigated using conventional electrochemical techniques and X-ray diffraction technique (XRD). FTO was chosen as a foreign substrate because of its high transparence and its properties as inert material. Within the potential range analyzed, the kinetics of the Co-Cu electrodeposition corresponded to a model including instantaneous nucleation on active sites and diffusion controlled cluster growth. The number of active sites of the substrate, N 0 , and the diffusion coefficient, D, were determined from the analysis of potentiostatic current transients on the basis of existing theoretical models. XRD patterns of the Co-Cu alloys thin films display fcc and hcp phase, with peaks quite close to those of the Co phase (fcc and hcp). Therefore, the variation of the composition of thin films alloy is possible depending on the deposition potential.

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Section: Introductionmentioning

confidence: 99%

A study of the electrodeposition of Co–Cu alloys thin films on FTO substrate

Mentar¹

2011

Ionics

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“…Guo et al [35] reported room temperature MR of 0.5 % for the as-deposited Co-Au alloys and of up to 1.5 % when annealed at 573 K. They found that the grain size of Co increased with the increase of annealing temperature. Previous studies [37], [38] have shown GMR values of up to 4 % for the as-deposited Co/Au multilayers prepared using pulsed-current electrodeposition in the cyanide solution and demonstrated how closely GMR and magnetic properties are correlated with the layer thickness and composition in the as-deposited Co/Ag and Co/Cu nanostructures [38], [39]. However, it is not yet fully clear to what extent deposition current density, annealing, and layer thickness have an effect on the grain size and on the electrical and magnetic properties of Co-Au alloys.…”

Section: Introductionmentioning

confidence: 99%

Magnetotransport Properties of Co-Au Granular Alloys

Rizal¹,

Ueda²,

Pokharel³

2011

IJAPM

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Abstract-A series of Cox-Au1-x granular alloys was grown using pulsed-current electrodeposition on polyimide substrates. The relationship between the giant magnetoresistance effect, saturation magnetization, and grain size was examined as the deposition current density and annealing temperatures were changed. A maximum magnetoresistance (MR) ratio of 4.5 % was obtained. The magnetization and ferromagnetic grain size of the as-deposited and annealed alloy films were examined against the deposition current density. The saturation magnetization decreased as the composition of Au was increased for both the alloys deposited at the current densities of 1 and 5 mA/cm2. The total magnetic moment further decreased on annealing. The grain size is found to be highly influenced by both the deposition current density and temperature. A low temperature magnetization measurement suggested that the ferromagnetic grain size decreases with increase in current densities. For the annealed samples, the ferromagnetic grain sizes were found to be dispersed in the Au matrix with different diameters. The decrease in magnetic moments with annealing is correlated with the grain size of the Co and its distribution in the gold matrix. The MR ratio increased with the increase in the deposition current density as a result of the formation of smaller grain size at higher deposition current densities.

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“…In this case, the formation of ferromagnetic clusters embedded in a nonmagnetic and conductive matrix makes this system interesting, especially in applications based on giant magnetoresistance (GMR; Berkowitz et al, 1992;Xiao et al, 1992). By contrast, electrodeposition is a good technique to produce Co-Cu solid solutions where Cu atoms substitute Co sites, forming a real alloy (Zaman et al, 1998;Bakkaloglu et al, 1998). The addition of Cu distorts the Co lattice parameters, strongly affecting the magnetic properties of the material and becoming an additional tool to tune the overall magnetic behavior of magnetic nanowire arrays (Karaagac et al, 2010;Kashi et al, 2011;Yang et al, 2011a,b).…”

Section: Co-cu Nanowiresmentioning

confidence: 99%