Manifold microchannel heat sinks: isothermal analysis

Copeland, David; Behnia, Masud; Nakayama, Wataru

doi:10.1109/95.588554

Cited by 87 publications

(16 citation statements)

References 5 publications

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“…However experimental results as depicted in 14 show a decrease in the thermal resistance as channel length increases which is consistent with a shift towards an "impingement mechanism". 13…”

Section: Effect Of Microchannel Lengthsupporting

confidence: 64%

“…Tables 5 and 6 summarize the temperature, velocity, local Nusselt number, product of apparent friction factor and Reynolds number, and pressure computations for inlet velocity of 1.0 m/s and 0.1 m/s respectively. Also included are the simple 1-D analytical results obtained based on the model used by ) 12 to predict hydraulic and thermal performance of manifold microchannel heat sinks. The detail formulation for the simple analytical model can be found in Copeland.…”

Section: Comparison Of Numerical and Analytical Resultsmentioning

confidence: 99%

“…The detail formulation for the simple analytical model can be found in Copeland. 12 The values of Nu and f Re for the numerical results were obtained as follows 22 : The numerical Nu x , ∆P and f Re results showed considerable differences as compared to that of the analytical models. This is expected as the analytical formulations were based on 1-D straight duct corre-lation, data and assumptions while the actual model consists of perpendicular entrance and exit.…”

Section: Comparison Of Numerical and Analytical Resultsmentioning

confidence: 99%

“…The assumptions involved were laminar flow, constant properties, uniform wall heat flux, uniform inlet velocity, zero gradients of velocity and pressure at the outlet boundary. 13 The fluid flow as solved by ANSYS/FLOTRAN follows the conventional Navier-Stokes equation. The Navier-Stokes equations are as follows:…”

Section: Numerical Modeling Proceduresmentioning

confidence: 99%

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Investigative Study of Manifold Microchannel Heat Sinks for Electronic Cooling Design

Poh

1999

Journal of Electronics Manufacturing

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Advances in microfabrication technology have allowed the use of microchannels in ultra compact, very efficient heat exchangers, which capitalize on the channels large surface area to volume ratio to transport high heat fluxes with small thermal resistances. One example is the cooling of microchips. However, the research into microscale flow and heat transfer phenomena conducted by various researchers provided substantial experimental data and considerable evidence that the behaviour of fluid flow and heat transfer in microchannels without phase change may be different than that which normally occurs in larger more conventional sized channels.This paper serves to perform a numerical analysis on the flow and heat transfer in manifold microchannels. A numerical model for 16 sets of parametric conditions is presented here using a CFD package, ANSYS/FLOTRAN. Pressure, temperature and velocity contour plots were obtained and analyzed. The results obtained were then compared with a derived analytical model. The predictions showed a large dependence on the flow rate. Differences in values and trends were expected as the analytical model assumed a straight channel unlike a manifold channel. Further comparisons were also made regarding the relationship between Reynolds number and the friction factor. Data were also compared with Copeland's simulation (1995) using FLUENT software and the agreement is good.

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Section: Effect Of Microchannel Lengthsupporting

confidence: 64%

Section: Comparison Of Numerical and Analytical Resultsmentioning

confidence: 99%

Section: Comparison Of Numerical and Analytical Resultsmentioning

confidence: 99%

Section: Numerical Modeling Proceduresmentioning

confidence: 99%

See 2 more Smart Citations

Investigative Study of Manifold Microchannel Heat Sinks for Electronic Cooling Design

Poh

1999

Journal of Electronics Manufacturing

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“…Due to their small size, compactness, and high surface-to-volume ratio, micro heat exchangers are most suitable for these requirements. One of the first applications of miniaturized devices for an enhanced heat transfer started in the microelectronic industry [1][2][3][4]. In order to guarantee an extended life time of electronic equipment, heat sinks with dissipation rates above 100 W cm -2 are necessary [5].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Heat Transfer on Micro‐Structured Surfaces Based on Entropy Production

Jasch

Scholl

2013

Chem Eng & Technol

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Surface structures with a well-defined shape and dimension in a staggered arrangement were evaluated in terms of their capability to improve the singlephase convective heat transfer in channels with small dimensions. Two evaluation criteria were used: (i) the thermal efficiency index, defined by the ratio of heat transfer enhancement and pressure drop increase, and (ii) the irreversible entropy generation which is determined by the entropy production rates through heat conduction and dissipation. Beside experimental measurements, parametric studies were performed using computational fluid dynamics to establish the entropy generation rates within the heated flow channel.

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Processing Issues in Fabricating Ceramic Micro‐Heat Exchangers by Joining Components

Kwon¹,

Kok²,

Fickes³

et al. 2006

Advances in Joining of Ceramics

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Manifold microchannel heat sinks: isothermal analysis

Cited by 87 publications

References 5 publications

Investigative Study of Manifold Microchannel Heat Sinks for Electronic Cooling Design

Investigative Study of Manifold Microchannel Heat Sinks for Electronic Cooling Design

Evaluation of Heat Transfer on Micro‐Structured Surfaces Based on Entropy Production

Processing Issues in Fabricating Ceramic Micro‐Heat Exchangers by Joining Components

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