INTRODUCTIONThe use of laser technology in the processing of materials for micro-products has been reported over the last decade. Laser-based material processing on a microscale has been used in thermal processing, shock peening, surface treatment, cleaning of surfaces, welding, melting and polishing, scribing, as well as micromachining of basic geometric features on a variety of materials [1][2][3][4][5][6][7][8][9][10][11][12].Lasers are usually categorized as two groups: continuous wave (cw) and pulsed lasers. Conventional cw and pulsed laser irradiation and ablation is used in many fields, such as material processing, machining, etching, deposition, sintering, micro-fluidics, medical, and many other applications [13][14][15][16][17][18][19].The use of lasers in micro-manufacturing is closely connected to the characteristics of the laser. The main laser parameters to be chosen and controlled are wavelength, λ (nm); average power (W) or energy (J); intensity (W/m 2 ) or fluence, ( ) (J/m 2 ); pulse duration, τ (s); pulse repetition rates (Hz); and peak power (pulse energy/pulse duration) [9,11,16,20,21].Pulsed lasers achieve much higher intensities than cw lasers and are the preferred solution for the fabrication of micro-sized structures. Long-pulsed (nanosecond, ns), short-pulsed (picoseconds, ps), and ultrashort-pulsed (femtosecond, fs) lasers that are commonly used for repairing, trimming, marking, scribing, texturing, welding, ablation, cutting, and drilling include among others (i) Excimer lasers with ultraviolet (UV) wavelengths, (ii) Ti:sapphire lasers Micro-Manufacturing: Design and Manufacturing of Micro-Products, First Edition. Edited by Muammer Koç and TugrulÖzel.