Material Gradients in Stretchable Substrates toward Integrated Electronic Functionality

Naserifar, Naser; LeDuc, Philip R.; Fedder, Gary K.

doi:10.1002/adma.201505818

Cited by 64 publications

(56 citation statements)

References 29 publications

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“…Integrating soft actuation, sensing and circuitry with microelectronics and other miniaturized rigid hardware introduces unique challenges in fabrication and interfacing. Some groups have worked to improve integration by unifying the fabrication of actuators and sensors 128 , while others have sought to introduce transitions in material stiffness that reduce the stress concentrations caused by impedance mismatches between stiff and soft components [129][130][131] . Further progress can also be accomplished through advancements in functionally graded materials and digital multimaterial 3D printing 42 , as well as improvements in soft-matter functionality that decrease reliance on rigid hardware.…”

Section: Nature Electronicsmentioning

confidence: 99%

Untethered soft robotics

2018

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Research in soft matter engineering has introduced new approaches in robotics and wearable devices that can interface with the human body and adapt to unpredictable environments. However, many promising applications are limited by the dependence of soft systems on electrical or pneumatic tethers. Recent work in soft actuation and electronics has made removing such cords more feasible, heralding a variety of applications from autonomous field robotics to wireless biomedical devices. Here we review the development of functional untethered soft robotics. We focus on recent advances in soft robotic actuation, sensing and integration as they relate to untethered systems, and consider the key challenges the field faces in engineering systems that could have practical use in real-world conditions.

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Section: Nature Electronicsmentioning

confidence: 99%

Untethered soft robotics

2018

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“…[216][217][218][219] Recently, this approach has been improved toward a stretchable electronic substrate by employing multiple soft polymer layers patterned around silicon chips, which act as surrogates for conventional CMOS electronics chips, to create a controllable stiffness gradient. 220 In terms of the optimal layout configuration to mitigate the stress and strain effects, Yuan et al 194 reported a ring oscillator with different orientation layouts in each inverter cell. The two types of inverter cell layouts presented in this work include (1) the p-channel perpendicular to the nchannel (perpendicular layout) and (2) the p-channel parallel to the n-channel (parallel layout).…”

Section: B Circuit-level Bending Stress Effect Mitigationmentioning

confidence: 99%

Bending induced electrical response variations in ultra-thin flexible chips and device modeling

Heidari

Wacker

Dahiya

2017

Applied Physics Reviews

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Electronics that conform to 3D surfaces are attracting wider attention from both academia and industry. The research in the field has, thus far, focused primarily on showcasing the efficacy of various materials and fabrication methods for electronic/sensing devices on flexible substrates. As the device response changes are bound to change with stresses induced by bending, the next step will be to develop the capacity to predict the response of flexible systems under various bending conditions. This paper comprehensively reviews the effects of bending on the response of devices on ultra-thin chips in terms of variations in electrical parameters such as mobility, threshold voltage, and device performance (static and dynamic). The discussion also includes variations in the device response due to crystal orientation, applied mechanics, band structure, and fabrication processes. Further, strategies for compensating or minimizing these bending-induced variations have been presented. Following the in-depth analysis, this paper proposes new mathematical relations to simulate and predict the device response under various bending conditions. These mathematical relations have also been used to develop new compact models that have been verified by comparing simulation results with the experimental values reported in the recent literature. These advances will enable next generation computer-aided-design tools to meet the future design needs in flexible electronics.

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“…By contrast, wrinkle formation was suppressed in the PRI area; implying that the PRI accurately served as a strain-free area. From this gradual wrinkling phenomenon or gradual strain-absorbing design with a stress-matched amplitude, it is expected that the stress-localizing instability occurred in rigid-to-soft transition area4950 could be overcome with an engineered wrinkle profile compared to the profile with uniform amplitude and wavelength (Fig. 2i).…”

Section: Resultsmentioning

confidence: 99%

Fully printable, strain-engineered electronic wrap for customizable soft electronics

Byun

Lee

et al. 2017

Sci Rep

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Rapid growth of stretchable electronics stimulates broad uses in multidisciplinary fields as well as industrial applications. However, existing technologies are unsuitable for implementing versatile applications involving adaptable system design and functions in a cost/time-effective way because of vacuum-conditioned, lithographically-predefined processes. Here, we present a methodology for a fully printable, strain-engineered electronic wrap as a universal strategy which makes it more feasible to implement various stretchable electronic systems with customizable layouts and functions. The key aspects involve inkjet-printed rigid island (PRI)-based stretchable platform technology and corresponding printing-based automated electronic functionalization methodology, the combination of which provides fully printed, customized layouts of stretchable electronic systems with simplified process. Specifically, well-controlled contact line pinning effect of printed polymer solution enables the formation of PRIs with tunable thickness; and surface strain analysis on those PRIs leads to the optimized stability and device-to-island fill factor of strain-engineered electronic wraps. Moreover, core techniques of image-based automated pinpointing, surface-mountable device based electronic functionalizing, and one-step interconnection networking of PRIs enable customized circuit design and adaptable functionalities. To exhibit the universality of our approach, multiple types of practical applications ranging from self-computable digital logics to display and sensor system are demonstrated on skin in a customized form.

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Material Gradients in Stretchable Substrates toward Integrated Electronic Functionality

Cited by 64 publications

References 29 publications

Untethered soft robotics

Untethered soft robotics

Bending induced electrical response variations in ultra-thin flexible chips and device modeling

Fully printable, strain-engineered electronic wrap for customizable soft electronics

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