“…The integration aspects involve fabrication of basic circuits for microwave signal generation, upconversion of digital data streams, and combining baseband and subcarrier multiplexed signals onto an optical carrier. New techniques are needed to efficiently interface microwave and photonic components at the transmitter and receiver [13], [14]. Circuit complexity and link performance are related through the choice of subcarrier data-modulation format, incoherent or coherent detection, the integration technology, and the overall systems architecture.…”