Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer

Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, In-Su; Kim, Jihye; Son, Kyungjune; Park, Hyunwook; Watanabe, Atom O.; Raj, P. Markondeya; Tummala, Rao; Kim, Joungho

doi:10.1109/temc.2021.3059846

Cited by 14 publications

(4 citation statements)

References 18 publications

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“…In spite of these advantages, the low-loss of the glass substrate is vulnerable to power/ground noise in the power delivery network (PDN) since the low-loss property of the substrate cannot suppress the induced noise naturally [13][14][15][16]. When the power/ground noise is induced in the PDN due to simultaneous switching noise (SSN), PDN resonance generates a large PDN impedance at certain frequencies, and the return current is affected.…”

Section: Figurementioning

confidence: 99%

“…Through via to trough via noise couplings in the glass and silicon interposers were also measured and compared in the frequency domain (Figure 14) and in the time domain (Figure 15). For the measurement, GS patterns were fabricated [15,[21][22][23]. The top-side probing image is included in Figure 14.…”

Section: Through Via Characterization and Comparison Between Through ...mentioning

confidence: 99%

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Electrical Performance Analysis of High-Speed Interconnection and Power Delivery Network (PDN) in Low-Loss Glass Substrate-Based Interposers

Kim

2023

Micromachines

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In this article, electrical performance analysis of high-speed interconnection and power delivery network (PDN) in low-loss glass substrate-based interposers is conducted considering signal integrity (SI) and power integrity (PI). The low-loss glass substrate is a superior alternative to silicon substrate in terms of high-speed signaling and fabrication yield. However, the low-loss of the substrate is vulnerable to power/ground noise in the PDN since the low-loss property of the substrate cannot suppress the noise naturally. In this article, an in-depth electrical performance analysis is conducted based on various measurements and simulations to fully benefit the advantages of the low-loss glass substrate. First, the fabrication process and test vehicles for the analysis are explained. Using the test vehicles, the electrical performance of the glass interposer’s high-speed interconnection is compared with those of silicon and organic interposers. The insertion loss, eye-diagrams, and signal bandwidths of three interposer channels are compared and analyzed based on electromagnetic (EM) and circuit simulations. Also, the electrical performance of the through glass via (TGV) channel is measured and compared with through silicon via (TSV) channel. The high-speed interconnection of the glass interposer showed better performance for most of the parameters which is more suitable for maintaining the SI. Even though the low-loss of the glass substrate ensured the SI, power/ground noise issues in the PDN must be analyzed and solved. In this article, various cases inducing the power/ground noise in the PDN are considered, simulated, and measured. To solve the issues, ground TGV design and electromagnetic bandgap (EBG) design are proposed for an efficient broadband suppression of the noise generated in the glass interposer PDN.

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Section: Figurementioning

confidence: 99%

Section: Through Via Characterization and Comparison Between Through ...mentioning

confidence: 99%

Electrical Performance Analysis of High-Speed Interconnection and Power Delivery Network (PDN) in Low-Loss Glass Substrate-Based Interposers

Kim

2023

Micromachines

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“…Quartz glasses have been extensively used for many fields, such as semiconductor technology, optical instruments, inertial navigation and others [1,2]. For example, mirror lenses, hemispherical gyro resonator and so on are all made of quartz glass, and both processing accuracy and surface quality are highly required.…”

Section: Introductionmentioning

confidence: 99%

The effect of tool wear on the damaged layer thickness and tool wear rate in ultra-precision turning of quartz glass

Liu

Tong

et al. 2023

J. Micromech. Microeng.

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Quartz glasses have been extensively used for many fields, such as semiconductor technology, optical instruments, inertial navigation and others. Ultra-precision turning with diamond tools can achieve high surface accuracy when processing non-ferrous materials. In recent years, ultra-precision turning has also been tried to be applied to process brittle materials, but there are constraints including small removal amount and tool wear. When diamond tools are used to cut quartz glass, tool wear occurs under the combined action of thermal effect and mechanical friction, which will affect the damaged layer thickness of the processed quartz glass. In this paper, the tool wear factor is led into the calculation of the extrusion volume, and the damaged layer thickness is calculated by the extrusion volume. Combined with the results of quartz glass turning experiments and the calculated results by simulation, the effect of tool wear factor on the damaged layer thickness and the tool wear rate is analyzed. The analysis shows that tool wear will lead to chip fracture thickness decrease and extrusion volume increase. Combined action of these two aspects, the damage layer thickness keeps unchanged at first and then rises with the increase of tool wear. In addition, the experimental results show that the tool wear rate rises with the increase of tool wear.

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“…

Non cooled infrared thermal imaging cameras require external DC power supply. In practical applications, there may be abnormal situations where the power supply is reversed, and the actual power supply voltage exceeds or falls below the required voltage of the camera [1] . Traditional camera power modules do not have protective circuits or power noise suppression functions, which can cause camera damage and a decrease in infrared imaging quality.In response to this issue, this article proposes a circuit design based on the ADI power management chip LTC4365ITS8 # TRMPBF, which integrates EMI suppression, under-voltage, over-voltage, and power reverse protection functions, and has a light alarm function.Example verification and analysis show that the circuit suppresses common mode interference and serial mode interference from external switching power supplies, and improves the quality of infrared images;When there is an abnormal power supply as mentioned above, the protection circuit module will stop supplying power to the subsequent modules, protect the components of the subsequent modules from damage, and emit a light alarm [2] .

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mentioning

confidence: 99%

Design of a power supply protection circuit with EMI suppression function

Liu,

Tong

2023

3rd International Conference on Laser, Optics, and Optoelectronic Technology (LOPET 2023)

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Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer

Cited by 14 publications

References 18 publications

Electrical Performance Analysis of High-Speed Interconnection and Power Delivery Network (PDN) in Low-Loss Glass Substrate-Based Interposers

Electrical Performance Analysis of High-Speed Interconnection and Power Delivery Network (PDN) in Low-Loss Glass Substrate-Based Interposers

The effect of tool wear on the damaged layer thickness and tool wear rate in ultra-precision turning of quartz glass

Design of a power supply protection circuit with EMI suppression function

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