Modeling of fluorine-based high-density plasma etching of anisotropic silicon trenches with oxygen sidewall passivation J. Appl. Phys. 94, 6311 (2003); 10.1063/1.1621713Reduction of silicon recess caused by plasma oxidation during high-density plasma polysilicon gate etching Effects of gas distribution on polysilicon etch rate uniformity for a low pressure, high density plasma Evolution of etched profiles has been numerically studied during low-pressure, high-density ͑LPHD͒ plasma etching of Si in Cl 2 . The surface etch rates were calculated using a reaction model of synergism between incoming ions and neutral reactants, including the spread of ion angular distributions due to their thermal motions and the transport of neutrals arising from the reemission on surfaces in a microstructure. Etched profiles were then simulated using a so-called two-dimensional string algorithm to examine the effects of ion temperature kT i and energy ͑or sheath voltage͒ eV s on the etch anisotropy for different neutral-to-ion flux ratios ⌫ n /⌫ i toward the substrate. Numerical results indicated that in typical Cl 2 LPHD plasma etching environments, where the neutral-to-ion flux ratio is ⌫ n /⌫ i ϳ 1 and the ratio of sheath voltage to ion temperature is eV s /kT i ϳ 100, the chlorinated surface coverage is microscopically nonuniform in etched features: The coverage is very low at the bottom ͑␣ϳ0.1͒, whereas the sidewall surface ͑␣ϳ1͒ is almost saturated with neutrals. This microscopic nonuniformity of the coverage in etched features is the proposed mechanism responsible for the inversely tapered profiles that often occur in LPHD plasma etching. Additionally, the decrease in vertical etch rate in microstructures or the reactive-ion-etching lag due to neutral shadowing effects is also found to become significant in LPHD plasma etching. At such a low flux ratio of ⌫ n /⌫ i ϳ 1, more directional ions with a higher ratio of eV s /kT i տ 500 are required for the anisotropic etching; e.g., for an ion energy ͑or sheath voltage͒ of eV s ϭ 50 eV, the ion temperature in a plasma is required to be kT i Շ 0.1 eV.