Measurements of the intrinsic stress in thin metal films

Abermann, R.

doi:10.1016/0042-207x(90)93933-a

Cited by 209 publications

(102 citation statements)

References 11 publications

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“…This behavior has been frequently observed previously [1][2][3][4][5]. The detailed"evolution, and the magnitudes of the observed stresses, differ significantly amongst the materials used in our study.…”

Section: Resultsmentioning

confidence: 42%

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The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films

Floro

Hearne

Hunter

et al. 2001

Journal of Applied Physics

343

206

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Real-time measurements of stress evolution during the deposition of VolmerWeber thin films reveal a complex interplay between mechanisms for stress generation and stress relaxation. We observed a generic stress evolution from compressive to tensile, then back to compressive stress as the film thickened, in amorphous and polycrystalline Ge and Si, as well as in polycrystall;ne Ag, Al, and Ti. Direct measurements of stress relaxation during growth interrupts demonstrate that the generic behavior can occur even in the absence of stress relaxation. When relaxation did occur, the mechanism depended sensitively on whether the film was continuous or discontinuous, on the process conditions, and on the fildsubstrate interracial strength.For Ag films, interracial shear dominated the early relaxation behnavior, whereas this mechanism was negligible in Al films due to the much stronger bonding at the A1/SiOz interface. For amorphous Ge, selective relaxation of tensile stress was observed only at elevated temperatures, consistent with surface-diffusion-based mechanisms. In "all the films studied here, stress relaxation was suppressed after the films became continuous...

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Section: Resultsmentioning

confidence: 42%

“…Previous work has shown that a complex evolution of the film stress is associated with V-W growth [1][2][3][4][5]. It is only now becoming widely appreciated that this behavior arises from a dynamic interplay between different stress generation mechanisms, coupled with a variety of possible mechanisms for stress relaxation.…”

Section: Introductionmentioning

confidence: 99%

The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films

Floro

Hearne

Hunter

et al. 2001

Journal of Applied Physics

343

206

View full text Add to dashboard Cite

show abstract

“…For the Ag capped FePt film, the in-plane tension thermal stress, originating from the Ag cap layer, would force the FePt thin film in-plane unit cell expansion, which would relieve the externally applied stress, resulting in (001) orientation in the FePt films. Additionally, considering that the thermal stress originates from the SiO2 substrates of −1.34 GPa and the intrinsic residual tensile stress in sputtering thin metal films of 1.2 to 1.5 GPa [21,22], the stress originating from the substrates will be negligible. Thus, the total thermal stress is equal to that originating from the cap layer.…”

Section: Discussionmentioning

confidence: 99%

Effects of Ru and Ag cap layers on microstructure and magnetic properties of FePt ultrathin films

Jin¹,

Liang²,

Cao³

et al. 2016

Nano Online

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“…Residual tensile stresses on the order of 1.2-1.5 GPa have been observed in thin films produced by dc magnetron sputtering. 11 If these residual stresses are accounted for, the total stress in the film ͑thermal plus residual͒ changes significantly from Fig. 1͑a͒; this is shown in Fig.…”

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confidence: 96%

Texture formation in FePt thin films via thermal stress management

Rasmussen¹,

Rui²,

Shield³

2005

Applied Physics Letters

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The transformation variant of the fcc to fct transformation in FePt thin films was tailored by controlling the stresses in the thin films, thereby allowing selection of in- or out-of-plane c-axis orientation. FePt thin films were deposited at ambient temperature on several substrates with differing coefficients of thermal expansion relative to the FePt, which generated thermal stresses during the ordering heat treatment. X-ray diffraction analysis revealed preferential out-of-plane c-axis orientation for FePt films deposited on substrates with a similar coefficients of thermal expansion, and random orientation for FePt films deposited on substrates with a very low coefficient of thermal expansion, which is consistent with theoretical analysis when considering residual stresses.

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Measurements of the intrinsic stress in thin metal films

Cited by 209 publications

References 11 publications

The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films

The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films

Effects of Ru and Ag cap layers on microstructure and magnetic properties of FePt ultrathin films

Texture formation in FePt thin films via thermal stress management

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