2006
DOI: 10.1063/1.2192352
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Measurements of the Material Properties of a Laminated Piezoelectric Stack at Cryogenic Temperatures

Abstract: Future NASA missions require cooling of large structures in space. One class of thermal management solutions for providing controlled, distributed cooling would utilize actively controlled micro-scale valves that are integrated with heat exchangers and sensors in order to provide independent, local temperature control. The most attractive actuation method for these micro-valves is a multilayer piezoelectric (PZT) stack because this technology is capable of providing large force using reasonable voltages (e.g.,… Show more

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Cited by 24 publications
(13 citation statements)
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“…8, as the temperature decreases, the PZT actuation has a decreased effect on flow rate modulation. This is mainly due to a degradation of the PZT stack that occurs because of the decreased piezoelectric constant at lower temperatures [28]. The decreased effectiveness in flow modulation is also apparent in decreased hysteresis.…”
Section: Discussionmentioning
confidence: 98%
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“…8, as the temperature decreases, the PZT actuation has a decreased effect on flow rate modulation. This is mainly due to a degradation of the PZT stack that occurs because of the decreased piezoelectric constant at lower temperatures [28]. The decreased effectiveness in flow modulation is also apparent in decreased hysteresis.…”
Section: Discussionmentioning
confidence: 98%
“…A small displacement provided by piezoelectric actuation is further reduced at cryogenic temperatures [28]. This limited displacement is compensated by perimeter augmentation of the valve flow passage.…”
Section: Device Structure and Operationmentioning
confidence: 99%
“…Germany. To determine the range of the finestage, we extrapolated data from reference [22] for the actuator constant from 20 K to 0 K. …”
Section: Methodsmentioning
confidence: 99%
“…The stress was simulated by thermal-structural analysis using the FEM analysis. In this simulation, the non-linear characteristics of materials at an ultralow temperature were used (10)- (13) . These characteristics were the CTE of all the materials and Yang's moduli of all metals.…”
Section: Simulation Of Thermal Stress Of Bltmentioning
confidence: 99%