“…Polymer dielectrics are extensively utilized in electronic devices because of their easy processing, flexibility, and light weight [ 1 , 2 , 3 , 4 , 5 , 6 ]. However, the low thermal conductivity of polymer dielectrics cannot meet the rising demand of efficient heat dissipation due to continues miniaturization electronic devices with high speed and high power [ 5 , 7 , 8 , 9 ]. Incorporation of thermally conductive fillers into polymer matrix is regarding as an effective strategy to improve the thermal conductivity of materials [ 10 , 11 , 12 , 13 , 14 ].…”