2013
DOI: 10.1116/1.4804175
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Mechanical and electrical properties of plasma and thermal atomic layer deposited Al2O3 films on GaAs and Si

Abstract: Mechanical and electrical properties of Al2O3 films are compared for plasma-assisted atomic layer deposition (ALD) and thermal ALD on two substrates, GaAs and Si, of different thermal expansion coefficient. Films with stable chemical structure and mechanical residual stress could be produced by both techniques without inducing any damage to sensitive multiquantum-well structures. However, the as-deposited residual stress in the plasma ALD Al2O3 films is lower and decreases, while that in the thermal ALD films … Show more

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Cited by 16 publications
(10 citation statements)
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“…The values of r s and r i were around 1 nm irrespective to t and OFR. Figure 3 also shows d m with an accuracy of ± 0.1 g/cm 3 [21] as a function of t , which was evaluated from the XRR measurements. The a -ITO films with t of more than 10 nm exhibited d m of about 7.2 g/cm 3 , which was almost the same as that of bulk ITO [12].…”
Section: Resultsmentioning
confidence: 99%
“…The values of r s and r i were around 1 nm irrespective to t and OFR. Figure 3 also shows d m with an accuracy of ± 0.1 g/cm 3 [21] as a function of t , which was evaluated from the XRR measurements. The a -ITO films with t of more than 10 nm exhibited d m of about 7.2 g/cm 3 , which was almost the same as that of bulk ITO [12].…”
Section: Resultsmentioning
confidence: 99%
“…Mechanical studies on ALD films mostly concentrated on elastic modulus, hardness measurement, or residual stress and can be classified into work on single compound film materials, mainly oxides and nitrides, prepared on stiff substrates, like Si or glass [15,16,17,18,19,20,21,22,23,24,25,26] and Al 2 O 3 [27]. The mechanical properties of nanolaminates films have also been investigated on stiff substrates [19,28,29,30,31,32,33,34].…”
Section: Introductionmentioning
confidence: 99%
“…The growth of films with ALD typically includes four steps: exposure of the surface to the first precursor, purge of the reaction chamber to remove the non-reacted precursors and the gaseous reaction by-products, exposure to the second precursor, and again purge or evacuation of the reactor chamber. The surface reactions can be accomplished using thermal chemistry or with the assistance of plasma [8]. The process temperature depends on the precursor and is typically in the range of 30 to 150 °C [9].…”
Section: Introductionmentioning
confidence: 99%