2023
DOI: 10.1016/j.jeurceramsoc.2022.12.030
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Mechanical and heat transfer properties of AlN/Cu joints based on nanosecond laser-induced metallization

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Cited by 11 publications
(5 citation statements)
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“…The results showed that the interfacial phase in region A was Al 4 Cu 9 , where the atoms were ordered along the (010) crystal plane with a crystal plane spacing of 0.882 nm. The above results were consistent with our previous conclusions [30,31] that laser-induced metallized AlN ceramic and Cu achieved metallurgical bonding through Cu-Al eutectic reaction. It is worth noting that this method can realize the joining between ceramic and Cu without additional brazing ller alloy.…”
Section: Interfacial Microstructure and Properties Of Aln/cu Jointssupporting
confidence: 93%
See 1 more Smart Citation
“…The results showed that the interfacial phase in region A was Al 4 Cu 9 , where the atoms were ordered along the (010) crystal plane with a crystal plane spacing of 0.882 nm. The above results were consistent with our previous conclusions [30,31] that laser-induced metallized AlN ceramic and Cu achieved metallurgical bonding through Cu-Al eutectic reaction. It is worth noting that this method can realize the joining between ceramic and Cu without additional brazing ller alloy.…”
Section: Interfacial Microstructure and Properties Of Aln/cu Jointssupporting
confidence: 93%
“…Therefore, the ceramic surface can be metallized without adding extra materials, which is conducive to subsequent combination with Cu. In our previous work [30,31], pre-treatment by laser metallization of ceramic has been demonstrated to achieve the bonding of AlN ceramic and Cu. Nonetheless, the process still needs to be improved to obtain better performance.…”
Section: Introductionmentioning
confidence: 99%
“…Laser-activated aluminum nitride ceramic metallization utilizes laser shock to form an aluminum layer on the surface of aluminum nitride, followed by chemical copper coating to prepare conductive circuits. It is a promising method of directly preparing circuits on heteromorphy devices [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, many researchers were also interested in methods to release residual stress in the joint. Liu et al [ 19 ] directly joined copper and AlN ceramic without a brazing alloy through laser-induced metallization of an AlN ceramic. They found that the micro-groove structures fabricated by laser irradiation significantly increased the jointing area of the joints and played the role of mechanical interlocking, which was conducive to improving the shear strength.…”
Section: Introductionmentioning
confidence: 99%