Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

Zhang, Panpan; Zhang, Ke; Dou, Shuliang; Zhao, Jiupeng; Yan, Xiangqiao; Li, Yao

doi:10.3390/cryst10030173

Cited by 5 publications

(4 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…PIs are one class of high-performance polymers containing imide rings ( Figure 1 ). They exhibit superior performance driven by their rigid aromatic structures and imide rings [ 45 , 46 , 47 , 48 ]. Since aromatic PI was first prepared, PIs have developed into various aliphatic, aromatic, and aliphatic–aromatic structures and dominant engineering plastic for high-temperature resistance applications [ 49 , 50 , 51 ].…”

Section: Pi Basic Informationmentioning

confidence: 99%

Research Progress and Application of Polyimide-Based Nanocomposites

Liu

Wang

et al. 2023

Nanomaterials

View full text Add to dashboard Cite

Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

show abstract

Section: Pi Basic Informationmentioning

confidence: 99%

Research Progress and Application of Polyimide-Based Nanocomposites

Liu

Wang

et al. 2023

Nanomaterials

View full text Add to dashboard Cite

show abstract

“…The differences in the breakdown strength of the three kinds of porous films were primarily caused by the films' different internal pore structures and defects. In addition, it can be seen that compared with the polyimide film without pores, the breakdown strength of porous films has dropped a lot [26], which is mainly due to the increase of defects caused by the introduction of pores.…”

Section: Analysis Of Dielectric Propertiesmentioning

confidence: 99%

Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Zhang

et al. 2021

Crystals

Self Cite

View full text Add to dashboard Cite

Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of theoretical and practical significance in the application of polyimide for 5G communications. In this work, different fluorinated graphene/polyamic acids (FG/PAA) were used as the precursor, and the porous polyimide film was successfully prepared by phase inversion. The dielectric constant of the porous polyimide film is relatively low, being less than 1.7. When the content of fluorinated graphene is 0.5 wt%, the overall dielectric performance of the porous film is the best, with a dielectric constant of 1.56 (10 kHz) and a characteristic breakdown field strength of 56.39 kV/mm. In addition, the mechanical properties of the film are relatively poor, with tensile strengths of 13.87 MPa (0.2 wt%), 13.61 MPa (0.5 wt%), and 6.25 MPa (1.0 wt%), respectively. Therefore, further improving the breakdown resistance and mechanical properties of the porous film is essential for the application of porous ultra-low dielectric polyimide materials.

show abstract

“…Polyimide (PI) is a class of high‐performance polymer that contains imide rings in its backbone. PI has excellent thermal and chemical stability, insulation, and good mechanical properties 36–41 due to its rigid aromatic construction and imide rings. It has been widely used in fields of electrical, aerospace, microelectronic devices, gas separation technology, polymer electrolyte fuel and so on 42–52 .…”

Section: Introductionmentioning

confidence: 99%

Synthetic strategies for highly transparent and colorless polyimide film

Liu

Wang

2022

J of Applied Polymer Sci

View full text Add to dashboard Cite

Polyimide (PI) is one of the best engineering plastics with excellent thermal, mechanical, dielectric performance and chemical stability. Among various PI products, film is one of the most dominant types. If PI films are to be applied to optical devices and display equipment, it is necessary to improve their optical transparency in the ultraviolet–visible region. However, improving the optical transparency of PI films would affect their thermal performance including thermal and dimensional stability. Therefore, how to balance optical and thermal performance to obtain highly transparent PI films with the best overall performance becomes a focus of current research field. In this review, we categorize transparent PI films into highly transparent PI, transparent PI with high glass transition temperature (Tg) and transparent PI with low coefficient of thermal expansion (CTE) based on their optical and thermal properties. Then, we review research progress in the field of polymer molecular design including synthesis strategies and properties in recent 5 years, to inspire research ideas and elaborate on the possible ways to develop high‐performance, colorless and transparent PI materials.

show abstract

Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

Cited by 5 publications

References 22 publications

Research Progress and Application of Polyimide-Based Nanocomposites

Research Progress and Application of Polyimide-Based Nanocomposites

Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Synthetic strategies for highly transparent and colorless polyimide film

Contact Info

Product

Resources

About