The great challenge
facing additive manufacturing is that the available
high-performance 3D printing materials can hardly keep up with the
rapid development of new additive manufacturing technology. Then,
the commercial resins available in the market have some problems,
such as poor thermal stability, insufficient light-curing degree,
and large shrinkage after curing, which need to be solved urgently.
This study reports a photocurable polyimide ink for digital light
processing (DLP) 3D printing to prepare controllable 3D structures
with high thermal stability, low shrinkage, and excellent comprehensive
properties. In this study, pyromellitic dianhydride and diaminodiphenyl
ether, the Kapton polyimide with the highest performance synthesized
so far, were selected as raw materials, and 2,2′-bis(3,4-dicarboxylic
acid) hexafluoropropane dianhydride containing fluorine was introduced
to modify the branched-chain structure. The polyimide was prepared
by one-step imidization, and then the graft with photocurable double
bonds and certain functions was grafted by reaction of glycidyl methacrylate
with phenolic hydroxyl groups. In this work, the solubility of the
synthesized oligomer polyimide in organic solvents was greatly increased
by combining three methods, thereby allowing the formation of ink
for photocuring 3D printing, and the ink can be stacked to form low-shrinkage
polyimide with complex controllable shape. Polyimide printed by DLP
can produce complex structures with good mechanical character and
thermal stability and small shrinkage. Therefore, the polyimide prepared
in this study is considered to be a resin of great commercial possibility.
In addition, due to its properties, it has important development potential
in some fields with high demand for thermal stability, such as high-temperature
cooling valves, aerospace, and other fields.