Mechanical performance and electrical resistance of ultrasonic welded multiple Cu-Al layers

Shin, Hyung-Seop; Leon, Michael de

doi:10.1016/j.jmatprotec.2016.11.004

Cited by 60 publications

(17 citation statements)

References 15 publications

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“…It has been revealed the initial micro-bonds are formed through the broken Ni layer; thereafter, plastic flow expands the bonded 2 of 12 region. Moreover, the ultrasonic bonding of multi-layered sheets of battery materials has been studied by some researchers [14][15][16]. These studies have indicated that sufficient metallurgical adhesion and plastic flow can occur at each interface between the sheets.…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

Arimoto

Sasaki

Doi

et al. 2019

Metals

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A cylindrical tool was applied for ultrasonic bonding of multi-layered copper foil and a copper sheet to prevent damage to the foil during bonding. The strength of the joints bonded with the cylindrical tool was comparable to that of the joints bonded with a conventional knurled tool. The effect of the cylindrical surface tool on bondability was investigated thorough relative motion behaviors between the tool surface and the bonding materials, as well as on bond microstructure evolution. The relative motion was visualized with in-situ observation using a high-speed camera and digital image correlation. At shorter bonding times, relative motions occurred at the bonding interfaces of the foil and the copper sheet. Thereafter, the relative motion between the tool and the bonding material became predominant owing to bond formation at the bonding interface, resulting in a macroscopic plastic flow in the bonded region. This relative motion damaged the foil in knurled tool bonding, and the cylindrical tool achieved bonding without any damage.

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Section: Introductionmentioning

confidence: 99%

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

Arimoto

Sasaki

Doi

et al. 2019

Metals

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“…During ultrasonic spot welding, an infrared thermal imager was utilised to measure the temperature distribution around the horn tip, as reported by Shin et al [18]. The temperature profile is shown in Figure 2.…”

Section: Temperature Distributionmentioning

confidence: 99%

A review on ultrasonic spot welding of copper alloys

Yang

et al. 2020

Materials Science and Technology

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As a solid state joining process, ultrasonic spot welding has been proven to be a promising technique for joining copper alloys. However, challenges still remain in employing ultrasonic spot welding to join copper alloys. This article comprehensively reviews the current state of ultrasonic spot welding of copper alloys with a number of critical issues including materials flow, plastic deformation, temperature distribution, vibration, relative motion, vertical displacement, interface friction coefficient, online monitoring technique, coupled with the macrostructure and microstructure, the mechanical properties and electrical conductivity. In addition, the future trends in this field are provided.

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“…The dissimilar metal joining of aluminium and copper is required in electronic packaging applications, such as joining heatsink into the integrated chip packages [1]. However, the conventional joining of aluminium and copper always employs the methods of friction stir welding [2], brazing [3] and vacuum diffusion bonding [4].…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

Ren

Huang

2021

Science and Technology of Welding and Joining

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The effects of ultrasonic-assisted soldering parameters on the interfacial microstructural evolution and shear strength of designed Al/Sn-9.77Zn-11.36Bi-1.46Ag/Cu solder joints were investigated. The ultrasonic-assisted soldering process promoted the dissolution of Al substrate and roughed Al/solder interface, which improved the pinning effect of Sn-9.77Zn-11.36Bi-1.46Ag on Al substrate. With an increasing ultrasonic soldering temperature, time and power, more Al atoms dissolved from Al substrate and migrated across solder to the opposite Cu substrate to form Al-rich (Zn) solid solutions. Consequently, Al 4.2 Cu 3.2 Zn 0.7 formed between -AgZn 3 and Cu 5 Zn 8 layers at Cu substrate, resulting in thinner Cu 5 Zn 8 and higher shear strength of solder joints. The highest shear strength of solder joints (38.6 MPa) was achieved after ultrasonicassisted soldering at 300°C for 10 s under 9 W.

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Mechanical performance and electrical resistance of ultrasonic welded multiple Cu-Al layers

Cited by 60 publications

References 15 publications

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

A review on ultrasonic spot welding of copper alloys

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

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