Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

Xu, Siyang; Prasitthipayong, Anya; Pickel, Andrea D.; Habib, Ashfaque H.; McHenry, Michael E.

doi:10.1063/1.4812467

Cited by 9 publications

(2 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, deviations from HP relation contributing to a softening behaviour are also observed after a critical grain size (d c ). Due to the difference in the mechanical properties, which is greatly influenced by the microstructure [31,32] of the intermetallic phases and its transformation during milling, a significant difference in the force displacement curves manifested not only by the shapes of the load-penetration depth but also by the maximum penetration depth attained under the same conditions was observed when evaluated using Oliver and…”

Section: Effect Of Process Parameters On Mechanical Propertiesmentioning

confidence: 99%

Structural and Mechanical Behaviour of Al-Fe Intermetallics

Basariya¹,

KrishnaMukhopadhyay²

2018

Intermetallic Compounds - Formation and Applications

View full text Add to dashboard Cite

In this chapter, results of our recent investigations on Al-25%Fe (at.%), Al-30%Fe and Al-34.5%Fe alloys close to Al 3 Fe, Al 5 Fe 2 and Al 2 Fe intermetallic phases have been discussed. The effect of process parameters on structural aspects and mechanical behaviour of Al-Fe intermetallics has been studied. The high melting intermetallics that are difficult to prepare by conventional processing technique are easily synthesized in nanocrystalline state with a homogeneous structure by mechanical means. In this process, we have come out with a single orthorhombic Al 5 Fe 2 nanocrystalline intermetallic phase. Hardness measurements of intermetallic revealed an increase in hardness with a decreasing grain size up to a critical grain size, followed by a decrease. A decrease in hardness with a grain size refinement, an indication of softening behaviour, demonstrating the Inverse Hall-Petch (IHP)-like phenomenon has been observed in intermetallic compounds. The deviation from the regular Hall-Petch (HP) behaviour has been discussed using various deformation models based on the dislocations and grain boundary-mediated processes. The study is focused on investigations of Al-rich iron aluminide intermetallics to understand the structure property correlations. and exhibit different crystal structure and properties than their constituent elements. The composition of an intermetallic may vary within a restricted composition range known as homogeneity range. Since 2500 BC, metallurgists have used intermetallics, and its phases have attracted significant interests during the last few decades since they offer new prospects for developing structural materials for high-temperature applications. IntermetallicsAn increased need for new and novel materials with specified properties and particular application has attracted greater attention of metallurgists and material scientists in recent years.Intermetallics are one such material with a vast potential for application in a wide range of technologically important areas [1]. The first observation of an intermetallic was made in 1839 by Karl Karsten, when he observed a discontinuity in the action of acids on alloys of copper and zinc at the equi-atomic composition and suggested the formation of a compound. The compound is now popularly called as β-brass (CuZn). Intermetallics are already indispensable in many applications and offer the possibility of providing additional breakthrough in performance in, for example, high-temperature structural materials, magnetic materials and hydrogen storage materials. As a by-product of amorphization studies or alloying development, nanocrystalline intermetallic compounds can be synthesized. Nanocrystalline intermetallics possess improved mechanical properties at an ambient temperature. Bohn et al. [2] have suggested that nanocrystalline intermetallic compounds may have improved mechanical properties. Their study concludes several possible ways of improving strength and ductility. However, the strength of elemental nanocrystalline metals can be increa...

show abstract

Section: Effect Of Process Parameters On Mechanical Propertiesmentioning

confidence: 99%

Structural and Mechanical Behaviour of Al-Fe Intermetallics

Basariya¹,

KrishnaMukhopadhyay²

2018

Intermetallic Compounds - Formation and Applications

View full text Add to dashboard Cite

show abstract

“…[36][37][38][39][40] The main issue related to this procedure is the surface-mount device (SMD) attachment onto inkjet patterned substrates. An usual material employed for SMT is reflow paste, 41 a sticky mixture of flux and solder particles, but it shows incompatibility with inkjet-printed pads. Concerning this, solder particles on the reflow process were found to provoke a leaching effect by removing and damaging printed pads and generating undesired functional errors.…”

Section: Introductionmentioning

confidence: 99%

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Arrese

Vescio

Xuriguera

et al. 2017

Journal of Applied Physics

View full text Add to dashboard Cite

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature ($150 C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique. Published by AIP Publishing.

show abstract

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field

Hammad

Ragab

2019

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

Cited by 9 publications

References 36 publications

Structural and Mechanical Behaviour of Al-Fe Intermetallics

Structural and Mechanical Behaviour of Al-Fe Intermetallics

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field

Contact Info

Product

Resources

About