Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

Myung, Woo‐Ram; Kim, Yong‐Il; Jung, Seung‐Boo

doi:10.1016/j.jallcom.2014.01.078

Cited by 50 publications

(22 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Sn-58 wt.%Bi solder joints without epoxy addition failed at fewer than 10 drops regardless of the surface finish. 17 However, the drop reliability of Sn-58 wt.%Bi epoxy solder joints was enhanced in comparison with Sn-58 wt.%Bi solder joints. The average number of drops for Sn-58 wt.%Bi epoxy solder/ENIG and ENEPIG was 46 and 63, respectively.…”

Section: Methodsmentioning

confidence: 94%

“…15 To address this drawback of Sn-Bi alloys, an alternative method is addition of epoxy to Sn-58 wt.%Bi solder. [16][17][18] In our previous studies, such epoxy-enhanced Sn-58 wt.%Bi solders with organic solderability preservative (OSP) surface finish were examined. The results of shear and drop tests showed that addition of epoxy enhanced the bonding strength of lowmelting-temperature/brittle Sn-58 wt.%Bi solder joints.…”

Section: Introductionmentioning

confidence: 99%

“…The results of shear and drop tests showed that addition of epoxy enhanced the bonding strength of lowmelting-temperature/brittle Sn-58 wt.%Bi solder joints. 17,18 Also, designing for enhanced solder joint reliability is critical to long-lifetime electronic packages, because solder joints are prone to failure in the electronic package under various environmental conditions such as temperature, humidity, dust, shock, and vibration, making it important to evaluate solder joint reliability under harsh environmental conditions. 19,20 In this work, we demonstrate the effects of two surface finishes, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on epoxyenhanced Sn-58 wt.%Bi solder by means of boardlevel drop tests to evaluate the mechanical properties of the solder joints under constant temperature-humidity testing.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

Self Cite

View full text Add to dashboard Cite

The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/ 85% RH storage condition, new IMCs were formed on the Ni 3 Sn 4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

show abstract

Section: Methodsmentioning

confidence: 94%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

Self Cite

View full text Add to dashboard Cite

show abstract

“…Chuang et al 13 revealed that the microstructure of Sn-58Bi solder was refined by adding 0.5 wt.% Ce, and whiskers were not found in Sn-Bi-Ce alloy under high-temperature storage. Myung et al 14 studied the effect of epoxy resin on Sn-58Bi solder, and the shear strength of the Sn-58Bi-epoxy solder was about two times higher than that of Sn-58Bi solder. Li et al 15 studied the influence of reinforcement by Al nanoparticles on the microstructure development and hardness of Sn-58Bi solder; the tensile strength of the alloy increased as the Al content was increased.…”

Section: Introductionmentioning

confidence: 99%

Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder

Yang

Dai

Zhang

et al. 2015

Journal of Elec Materi

View full text Add to dashboard Cite

The effect of BaTiO 3 nanoparticles on the microstructure, wettability, and mechanical properties of Sn-58Bi solder has been investigated. The results show that the microstructure of the Sn-58Bi-x wt.%BaTiO 3 (x = 0.5, 1, 2, 3) composite solders is refined and homogeneous due to increasing heterogeneous nucleation sites of BaTiO 3 nanoparticles in the solder matrix. The best wettability with spreading coefficient of 0.86 was obtained for Sn-Bi-1 wt.%BaTiO 3 , increased by 10.24% compared with Sn-58Bi solder. High mechanical properties were achieved for Sn-58Bi solder with small addition (0.5 wt.% to 3 wt.%) of BaTiO 3 . The ultimate tensile strength (UTS) of Sn-58Bi is 44.7 MPa, and that of Sn-Bi-1%BaTiO 3 is 59.1 MPa. Fracture surface analysis indicated that the microscopic fracture of Sn-Bi-1%BaTiO 3 solder is composed of tearing marks and ductility is improved. Therefore, Sn-Bi1%BaTiO 3 composite solder is one of the candidates for packaging and interconnection applications.

show abstract

“…Sn-Bi solder is proposed as one of the most promising substitutes for lead-containing solder due to its lower melting temperature (412 K) and low coefficient of thermal expansion [1]. These characteristics provide its useful applications on energy saving, step soldering and the process that is sensitive to temperature or thermal damage [2].…”

Section: Introductionmentioning

confidence: 99%

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

Huang

et al. 2015

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

As one of the important factors affecting the quality of soldered joints, the interfacial intermetallic compound (IMC) formed at the solder/substrate interface is of increasing concern to researchers. Thus, the growth behavior of interfacial IMC in Sn58Bi/Cu solder joints was investigated as different cooling methods-quenched water, cooling in air, and cooling in a furnace during reflowing were used. In this work, the effect of cooling rate on interfacial IMC growth is studied in Sn58Bi/Cu system. Morphology and growth kinetics of the interfacial Cu-Sn IMC under various cooling rates were studied. It was found that only scallop-like Cu 6 Sn 5 IMC layer was observed between solder and Cu substrate in cases of water cooling and air cooling, while bi-layer composed of scallop-like Cu 6 Sn 5 and planar Cu 3 Sn was detected under furnace cooling due to sufficient reaction time to form Cu 3 Sn between Cu 6 Sn 5 IMC and Cu substrate which resulted from slow cooling rate. Samples with different reflow cooling rate were further thermal aged at 373 and 393 K, respectively. The results showed that the morphology of interfacial Cu-Sn IMC layer would transform from scallop-like to planar-like with increasing aging time, and the thickness of IMC increased linearly with square root of aging time. The growth constants of interfacial IMC layer were obtained and compared for different cooling rates and aging temperatures, indicating that the IMC layer thickness increased faster in samples under slow cooling rate than the fast cooling ones under the same aging condition, and higher aging temperature could result in faster growth of IMC layer. The interfacial Cu 6 Sn 5 grains gradually transformed to facet prismatic shape as the cooling rate decreased, and the grain size increased dramatically as the samples were cooled in furnace, comparing with that of samples cooled in water and air.

show abstract

Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

Cited by 50 publications

References 9 publications

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

Contact Info

Product

Resources

About