Mechanical Reliability of Embedded Array Capacitors in Ultrahigh-Performance Microprocessors

Panat, Rahul; Dattaguru, Sriram; Balkan, H.; Min, Yo‐Sep; Seh, Huankiat; Zhao, Xinyan

doi:10.1109/tdmr.2014.2331023

Cited by 10 publications

(1 citation statement)

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“…A PCB contains several traditional layers placed between multiple high-density interconnect (HDI) layers [5]. Microvias are used as electrical interconnects among different conducting layers in HDI technology [6], [7]. A significant number ranging from a few thousand to millions of microvias are used on a single PCB.…”

Section: Introductionmentioning

confidence: 99%

Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow

Abbas,

Yu,

Pecht

2023

IEEE Access

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The automotive industry's increasing dependence on compact electronic packages requires printed circuit boards with robust microvia interconnections. With a focus on minimizing failure rates and reducing costs, automotive manufacturers require that microvia reliability have zero failures. To achieve this, the automotive industry requires identification and understanding of the uncontrollable factors related to substrates that influence microvias during the reflow process. However, conventional studies not accounting for the non-uniform nature of substrates fail to capture the real-time impact of composite substrates on microvias during reflow, highlighting the need for comprehensive substrate analysis. In this paper, we present a detailed finite element model substrate layer to analyze the influence of the substrate material on microvia structures using the design of experiment technique using the Taguchi method. The results showed that the uneven distribution of fiber and resin ratios within the substrate layer affects the microvia structures. Microvias in resin-rich areas are more susceptible to failure with 33% higher stresses than those present in fiber-rich areas. Furthermore, printed circuit board substrate is characterized into different zones based on microvia failure risk levels.INDEX TERMS Finite element analysis, microvia, printed circuit board, reflow, reliability, substrates, Taguchi method.

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Section: Introductionmentioning

confidence: 99%

Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow

Abbas,

Yu,

Pecht

2023

IEEE Access

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3D Assembly of MXene Networks using a Ceramic Backbone with Controlled Porosity

Arslanoglu,

Yuan,

Panat

et al. 2023

Advanced Materials

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Transition metal carbides (MXenes) are novel two‐dimensional (2D) nanomaterials with exceptional properties, promising significant impact in applications such as energy storage and conversion, and catalysis. A major barrier preventing the widespread use of MXenes is the lack of methods for assembling MXene in 3D space without restacking, which degrades their performance. Here, we successfully overcome this challenge by introducing a novel material system: a 3D MXene network on a porous ceramic backbone. The backbone dictates the network's 3D architecture while providing mechanical strength, gas/liquid permeability, and other beneficial properties. Freeze casting is used to fabricate a silica backbone with open pores and controlled porosity, a MXene dispersion is infiltrated into the backbone using capillary flow, and the system is dried to conformally coat the pore walls, creating an interconnected 3D‐MXene network. The fabrication approach is reproducible, and the MXene‐infiltrated porous silica (MX‐PS) system is highly conductive (e.g., 340 S·m−1). The electrical conductivity is controlled by the porosity distribution, MXene concentration, and infiltration cycles. Sandwich‐type supercapacitors with MX‐PS electrodes produce excellent areal capacitance (7.24 F·cm−2) and energy density (0.32 mWh·cm−2) with only 6% added MXene mass. This approach of creating 3D architectures of 2D nanomaterials will significantly impact many engineering applications.This article is protected by copyright. All rights reserved

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