Mechanical stress as a function of temperature in aluminum films

Gardner, Donald S.; Flinn, P. A.

doi:10.1109/16.8790

Cited by 156 publications

(54 citation statements)

References 42 publications

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“…Above 85°C, the film deviates from linear behavior, suggesting that some microstructural changes are taking place [21]. Further temperature excursion is observed to result in a rapid decrease in the measured stress from -200 MPa at 100°C to about -75 MPa at 325°C.…”

Section: Measurement Of Cu-film Thicknessmentioning

confidence: 88%

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

et al. 2011

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In this study, the role of electrodeposition chemistry on thermo-mechanical behavior of different Cu-films is examined. For this study, three different Cu electrodeposition chemistries were analyzed using Timeof-Flight Secondary Ion Mass Spectroscopy (TOF-SIMS), Focused Ion Beam (FIB), Laser Scanning method, Electron Backscattered Diffraction, and the Nano-indentation techniques. It is found that the level of impurity in Cu-films, resulting from the used electrodeposition additives, has a significant impact on their microstructural and thermomechanical behavior. Cu-films having high impurity content showed residual stress levels that are three times higher than the less impure Cu-films. This implies that the use of such impure electrodeposition chemistry for the filling of TSVs will result in high residual stresses in the Cu-TSV, thus inducing higher stresses in Si, which could be a reliability concern. Therefore, the choice of the used electrodeposition chemistry for the filling of TSVs should not be limited only to the achievement of a void free Cu-TSV, as consideration ought to be given to their thermo-mechanical response.

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Section: Measurement Of Cu-film Thicknessmentioning

confidence: 88%

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

et al. 2011

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“…Wafer curvature measurements can provide important information about the film's elastic and plastic properties when either the coefficient of thermal expansion or the biaxial modulus is known. 2 Determination of these parameters for nanoinks has to be done empirically rather than inferred from literature.…”

Section: Introductionmentioning

confidence: 99%

Mechanical characterization of solution-derived nanoparticle silver ink thin films

Greer

Street

2007

Journal of Applied Physics

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Mechanical properties of sintered silver nanoparticles are investigated via substrate curvature and nanoindentation methods. Substrate curvature measurements reveal that permanent microstructural changes occur during initial heating while subsequent annealing results in nearly elastic behavior of the thinner films. Thicker films were found to crack upon thermal treatment. The coefficient of thermal expansion was determined from linear slopes of curvature curves to be 1.9± 0.097 ppm/°C, with elastic modulus and hardness determined via nanoindentation. Accounting for substrate effects, nanoindentation hardness and modulus remained constant for different film thicknesses and did not appear to be a function of annealing conditions. Hardness of 0.91 GPa and modulus of 110 GPa are somewhat lower than expected for a continuous nanocrystalline silver film, most likely due to porosity.

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“…Amorphous DLC films (sp 3 bonded) up to a few micrometers thick can be prepared by pulsed-laser deposition [20], magnetron sputtering with ion plating [21], or a filtered-cathode vacuum arc [22]. A few micrometer-thick aluminum films can be achieved by sputtering [23], [24], which is an established and proven microfabrication route. These material combinations could at best yield ∼1.2 kHz for L = 100 µm and are limited by the cooling rates achieved by conduction and natural convection at small scales.…”

Section: Resultsmentioning

confidence: 99%

Effect of Heat Transfer on Materials Selection for Bimaterial Electrothermal Actuators

Srinivasan

Spearing

2008

J. Microelectromech. Syst.

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Abstract-Bimaterial electrothermal actuation is a commonly employed actuation method in microsystems. This paper focuses on optimal materials selection for bimaterial structures to maximize the thermomechanical response based on electrothermal heat-transfer analysis. Competition between different modes of heat transfer in electrothermally actuated cantilever bimaterial is analyzed for structures at the microscale (10 µm ≤ L ≤ 1 mm) using a lumped heat-capacity formulation. The choice of materials has a strong influence on the functional effectiveness and the actuation frequency even though the electromechanical efficiency is inherently small (∼10 −5 ). Frequencies on the order of ∼100 Hz to 15 kHz can be obtained for bimaterial structures at small scales by varying either the operating temperature range or the rate of heat dissipation. It is found that engineering alloys/metals perform better than other classes of materials for high-work high-frequency (∼10 kHz) actuation within achievable temperature limits.[

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Mechanical stress as a function of temperature in aluminum films

Cited by 156 publications

References 42 publications

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Mechanical characterization of solution-derived nanoparticle silver ink thin films

Effect of Heat Transfer on Materials Selection for Bimaterial Electrothermal Actuators

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