Mechanical Stress Dependence of Power Device Electrical Characteristics

Usui, Masanori; Tanaka, Hiroaki; Hotta, Kazushi; Kuwano, Satoshi; Ishiko, M.

doi:10.1541/ieejias.128.577

Cited by 2 publications

(1 citation statement)

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“…Methods for the thermal analysis of power devices considering the wire connection layout have been analyzed using 3D FEM simulations [3], and a FEM-based evaluation method has been presented. The thermal fatigue reliability of power devices has also been described [4]- [15]. In this paper, a multiphysics algorithm ( coupled thermalelectrical and thermal-structural analyses ) is presented to evaluate the fatigue behavior of these devices [16].…”

Section: Introductionmentioning

confidence: 99%

Reliability evaluation of power semiconductor devices using coupled analysis simulation

Shinohara

2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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There is an increasing need to fabricate power devices that are lightweight and compact. However, reducing the weight of power devices would result in reduced stiffness, and greater compactness would result in increased current density, which, in turn, would increase the temperature of the device and cause deterioration. Thus, to realize lightweight, compact power devices with sufficient reliability, multiphysics fatigue analysis techniques that simultaneously consider electricity, heat, and stress should be developed. In the present paper, to accurately predict the fatigue properties of power devices, evaluation techniques based on multiphysics analysis are proposed. By using a multiphysics algorithm and comparing lead frame bonding to wire bonding found in literature, the reliability of lead frame bonding is estimated.

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