2005
DOI: 10.1016/j.apsusc.2005.01.118
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Mechanical stress in ALD-Al2O3 films

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Cited by 69 publications
(35 citation statements)
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“…Box 513, 5600 MB Eindhoven, The Netherlands; electronic mail: m.aghaee@tue.nl substrate during cooling, responsible for the appearance of cracks in the film. [22][23][24] Several single layers and multilayer stacks of TiO 2 , Al 2 O 3 , and ZnO prepared by thermal and plasma-assisted ALD on polymer substrates have been used for encapsulation and moisture barrier purpose. [25][26][27] Among these oxides, titanium dioxide is a promising material with good stability against degradation.…”
Section: Introductionmentioning
confidence: 99%
“…Box 513, 5600 MB Eindhoven, The Netherlands; electronic mail: m.aghaee@tue.nl substrate during cooling, responsible for the appearance of cracks in the film. [22][23][24] Several single layers and multilayer stacks of TiO 2 , Al 2 O 3 , and ZnO prepared by thermal and plasma-assisted ALD on polymer substrates have been used for encapsulation and moisture barrier purpose. [25][26][27] Among these oxides, titanium dioxide is a promising material with good stability against degradation.…”
Section: Introductionmentioning
confidence: 99%
“…It was also reported that electron beam causes amorphous ALD-Al 2 O 3 film ($20 nm) to crystallise [2]. Heat treatment or thermal cycling to 780-790 C also caused crystallisation of amorphous ALD-Al 2 O 3 film (25-60 nm) into different phases (, , , , , ) [6,7,12]. Furthermore, the experimental results showed that the partially transformed crystalline film has even higher dielectric constant than the amorphous film.…”
Section: Introductionmentioning
confidence: 64%
“…ALD-Al 2 O 3 film has especially attracted a great deal of attentions due to its high-dielectric constant (9 for Al 2 O 3 versus 3.9 for SiO 2 , both in amorphous state) [6][7][8][9] and high-thermal conductivity [9,10]. It is believed that Al 2 O 3 is the most chemically and thermodynamically stable insulator of all the pure metal oxides [7,9,11].…”
Section: Introductionmentioning
confidence: 99%
“…[131] Annealing temperatures were kept well below 800˚C, the transition temperature at which sharp increases in film stress were observed for t film > 60 nm, attributed to phase transitions from the amorphous to the polycrystalline state. [130] Katamreddy demonstrated that annealing ALD alumina films at 600ºC did not significantly change the amorphous properties of the film. [132] The amorphous structure of these Al 2 O 3 membranes after The hexagonal nanocrystallites labeled i,ii,iii are not oriented with the zone axis and thus crystal periodicity is not observed.…”
Section: Sio 2 Nanopore Fabricationmentioning
confidence: 99%
“…[130] Thermal annealing at 500˚C (30 minutes) was performed to help relax residual tensile film stress and to improve characteristic film strength. [131] Annealing temperatures were kept well below 800˚C, the transition temperature at which sharp increases in film stress were observed for t film > 60 nm, attributed to phase transitions from the amorphous to the polycrystalline state.…”
Section: Sio 2 Nanopore Fabricationmentioning
confidence: 99%