“…Moreover, the reader can find elsewhere excellent and comprehensive reviews that describe in detail the methods used to characterize, in the laboratory, molecular electronic properties through the formation of temporal metal-molecule contacts, but that are unsuitable for large-scale integration such as: In situ break junction (STM-BJ), mechanically controlled break junction (MCBJ), I(s) (I = current, s = distance) and I(t) (I = current and t = time) methods based on an STM, electromigration breakdown junction, liquid metal droplets, etc. [9,84,169,341]. In the MCBJ, firstly, a fine metal bridge is formed, and subsequently, this is cleaved upon bending the whole assembly allowing forming the molecular bridge.…”