2011
DOI: 10.1049/mnl.2011.0515
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Mechanism analysis of ultrasonic treatment on SU-8 swelling in UV-LIGA technology

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Cited by 7 publications
(4 citation statements)
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“…However, the relatively large development margin allowed all the patterns to be developed cleanly. Even though the resist shows some swelling before removal during the development, unlike some resists (such as SU-8) [12], it did not deform nearby microstructures. with a resist width of 5 µm which is higher than the estimated AR of 14.5 for 85 µm thick resist.…”
Section: (A) Resist Characterizationmentioning
confidence: 91%
“…However, the relatively large development margin allowed all the patterns to be developed cleanly. Even though the resist shows some swelling before removal during the development, unlike some resists (such as SU-8) [12], it did not deform nearby microstructures. with a resist width of 5 µm which is higher than the estimated AR of 14.5 for 85 µm thick resist.…”
Section: (A) Resist Characterizationmentioning
confidence: 91%
“…To prepare high-precision graphene/Ni composite microparts, a high-precision SU-8 glue mold [37,38] was first ensured; functional patterns of the required microparts were made on the gold-plated silicon wafer. The photolithography process involves cleaning the silicon substrate, glue application and homogenization, prebaking, exposure, post-baking, development, and blow-drying.…”
Section: The Su-8 Lithographymentioning
confidence: 99%
“…Such swelling behavior of SU8 is associated with soft baking and SU8 can absorb water and saturate in several tens of seconds, depending on the initial thickness [27]. Ultrasonic treatment for less than 15min can, however, increase SU-8 surface hydrophilicity and reduce SU8 swelling, leading to improved dimensional accuracy of electroplated counterparts [28]. Figure 11 shows trenches that were milled on an Al master using micromilling and the corresponding protruded features on the Ni tool.…”
Section: Ni Tool Insertmentioning
confidence: 99%