Mechanism of Near-Field Coupling Between Noise Source and EMI Filter in Power Electronic Converter and Its Required Shielding

Magnetic Coupling Common Mode Conducted EMI Analysis and Improvement in a Boost Converter

“…The actual measured CM conducted emission is much larger than the value predicted by the traditional EMI circuit model method [15], and it is even 20 dB higher at the switching frequency of 214 kHz. With reference to the research processes and results of the document [5,8,13], it can be inferred that there may be a near-field coupling effect in this boost converter. Since the near-field electromagnetic coupling theoretically exists between any two components, this will cause too many coupling parameters and greatly complicate the EMI circuit model.…”

“…With the rapid increase of power density of a power electronic converter and the wide application of faster wide bandgap power semiconductors, the near field coupling effect is also becoming stronger [6,7]. The strong coupling effect can directly affect the formation of EMI, and impact on the reasonable layout and structure design of internal components of a power electronic converter [8,9]. So it is very necessary to study various near field coupling effects and their suppression methods for a power electronic converter.…”

“…Researchers all over the world have conducted a variety of studies on the phenomena of near field coupling EMI in power electronic converters [4,5,[8][9][10][11][12][13][14]. These researches mainly focus on the attenuation performance deterioration of the EMI filter caused by its internal coupling effect [4,[9][10][11][12].…”

“…2021, 12, 225 2 of 10 filter, respectively [11,12]. In recent years, some researchers have further found that the stray near field from the main circuit of power converter also affects the performance of the EMI filter [5,8,13,14]. For example, Junping He, Henglin Chen, Boyi Zhang et al studied the stray magnetic field from an inductor of the main circuit on DM conducted emissions in detail [5,13,14].…”

Fabrication of Open‐Cell Microcellular Acrylonitrile Butadiene Styrene Composite Foams with Enhanced Electrical Conductivity and High‐Performance Electromagnetic Interference Shielding

“…Future work should focus on the formulation of materials with superior dielectric and magnetic loss, as these properties play a vital role in the shielding mechanism of the material. [44] Here, we will report a low-cost and large-scale production method to prepare highly conductive porous materials (HCPMs). This method can not only reduce the weight of the conductive material, but also reduce the content of the conductive filler without affecting the conductivity of the conductive material.…”