Mechanism of Structure Formation of Low-Dimensional Systems on the Basis of Electrodeposited Co–Cu Films on Cu and Si Substrates

Kasyutich, O. I.; Tochitskii, T. A.; Fedosyuk, V. M.

doi:10.1002/1521-396x(199708)162:2<631::aid-pssa631>3.0.co;2-y

Cited by 12 publications

(6 citation statements)

References 12 publications

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“…Regarding that Co and Cu are immiscible under equilibrium conditions, it is expected that some separation takes place when these two metals are codeposited. This separation is evidenced for a variety of electrolytes used for the deposition, either for dc deposition mode 11 or for pulse-plating. [12][13][14] The separation results in that some Co-rich regions can also be produced that are separated from the rest of the "magnetic" layer by a Cu-rich part of the layer.…”

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confidence: 91%

Ferromagnetic and Superparamagnetic Contributions in the Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

Liu

Péter

Pádár

et al. 2005

J. Electrochem. Soc.

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Co-Cu/Cu multilayers with Cu layer thickness ranging from 0.37 to 3.45 nm were deposited by galvanostatic/potentiostatic method from electrolytes with 5-200 mM Cu 2+ concentration. The composition analysis revealed an increasing Cu content of the magnetic layers with c͑Cu 2+ ͒. Magnetoresistance up to 8 kOe was measured for each sample. Samples with a thin Cu layer ͑i.e., 0.37 nm͒ exhibited anisotropic magnetoresistance. At higher Cu layer thicknesses, giant magnetoresistance was observed. The higher the Cu 2+ concentration, the smaller the slope of the magnetoresistance curves at low magnetic field and the higher the saturation field. Magnetoresistance curves were quantitatively separated into ferromagnetic and superparamagnetic contributions. While the ferromagnetic portion of the magnetoresistance varied with the Cu layer thickness in the same way, the superparamagnetic contribution was higher, the larger the Cu content of the magnetic layer. The size of the superparamagnetic regions decreased with increasing Cu content of the magnetic layers. The copper layer thickness dependence of the magnetoresistance properties could be elucidated by accounting for both the asymmetric nucleation of Co on Cu and vice versa and the variation of the Cu content of the magnetic layers. General conclusions on the electrodeposition of magnetic/nonmagnetic multilayers have also been drawn.

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confidence: 91%

Ferromagnetic and Superparamagnetic Contributions in the Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

Liu

Péter

Pádár

et al. 2005

J. Electrochem. Soc.

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“…The relatively inexpensive and simple electrodeposition method can also be applied for producing magnetic or nonmagnetic multilayers, including the Co-Cu system, with good GMR properties. 7 Numerous studies [8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26] have been reported on the preparation and characterization of electrodeposited Co-Cu/Cu multilayers in which the magnetic layer is, as a result of the nature of the electrodeposition method, not pure Co but rather a Co-rich Co-Cu alloy with magnetic properties very similar to those of pure Co. In spite of these efforts, the observed room temperature GMR in electrodeposited Co-Cu/Cu multilayers 12,[14][15][16][17][18][19][20]22,23,25 has remained below 20%, which is much smaller than the value found in sputtered Co/Cu multilayers.…”

mentioning

confidence: 99%

“…11, in which a 55% room temperature GMR has been reported for an electrodeposited Co-Cu/Cu multilayer; however, this result has not yet been confirmed by other authors.͒ Therefore, a challenge remains to clarify the parameters of electrodeposition that govern the GMR behavior of magnetic or nonmagnetic multilayers. Abundant literature data are available for Co-Cu/Cu multilayered films deposited with either potential [9][10][11][12][13][14][15][16][17][18][21][22][23][24][25][26] or current control. 8,19,20 In this paper, we report results obtained for electrodeposited Co-Cu/Cu multilayers prepared under current control.…”

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confidence: 99%

Microstructure and Giant Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

Péter

Cziráki

Pogány

et al. 2001

J. Electrochem. Soc.

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Direct current plating, pulse plating, two-pulse plating, and reverse pulse plating were used to produce electrodeposited Co-Cu alloys and Co-Cu/Cu multilayers under galvanostatic control from an electrolyte containing CoSO 4 and CuSO 4 . Atomic force microscopy, X-ray diffraction, and transmission electron microscopy were used to study the sample structure and morphology. Direct current plating resulted in a Co 95 Cu 5 alloy with nearly equal amounts of face-centered cubic ͑fcc͒ and hexagonal close packed phases, while all pulsed current methods yielded multilayers with fcc structure. Giant magnetoresistance ͑GMR͒ behavior was observed in the multilayers with a maximum magnetoresistance ͑MR͒ ratio of about 9% as measured at 8 kOe. The shape of the MR curves and the magnitude of the GMR were very similar, regardless of the sign of the current between the Co deposition pulses. The results of structural studies also confirmed the formation of a multilayer structure for each pulsed electrodeposition mode. The conclusion was that the spontaneous exchange reaction between Co and Cu 2ϩ is responsible for the formation of a pure Cu layer even under reverse pulse plating conditions. The GMR of the multilayer deposits decreased with increasing bilayer number, due to the deterioration of the microstructure as the deposit grew.

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“…Metal electrodeposition is one of the methods used to synthesize nano-and microdimensional lms. [26][27][28][29][30][31][32][33][34][35] Electrodeposition is an electrochemical process that allows the preparation of solid deposits of a wide range of thicknesses 27,[36][37][38][39][40][41][42] on the surface of conductive materials. It is a highly commercially relevant process, providing the basis for many industrial applications, such as electrowinning, rening, and metal plating.…”

Section: Introductionmentioning

confidence: 99%

The influence of saccharin adsorption on NiFe alloy film growth mechanisms during electrodeposition

et al. 2022

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Mechanism of Structure Formation of Low-Dimensional Systems on the Basis of Electrodeposited Co–Cu Films on Cu and Si Substrates

Cited by 12 publications

References 12 publications

Ferromagnetic and Superparamagnetic Contributions in the Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

Ferromagnetic and Superparamagnetic Contributions in the Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

Microstructure and Giant Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

The influence of saccharin adsorption on NiFe alloy film growth mechanisms during electrodeposition

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