Mechanism study of Cu-Zn alloys electrodeposition in deep eutectic solvents

Liu, Aimin; Shi, Zhongning; Reddy, Ramana G.

doi:10.1007/s11581-019-03418-2

Cited by 50 publications

(23 citation statements)

References 46 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This result indicated the typical face-centred cubic (fcc) crystalline structure with Cu and Zn atoms. The other XRD results also showed 2pp at 2θ of 43 • and 50 • for CuZn [63], Cu 3 Zn [64], and Cu 5 Zn 8 [65]. Therefore, this is a superlattice structure, which is a combination of CuZn, Cu 3 Zn, and Cu 5 Zn 8 , as shown at the right of Figure 6.…”

Section: Superlattice Structure Analysismentioning

confidence: 82%

Structural Strength Analyses for Low Brass Filler Biomaterial with Anti-Trauma Effects in Articular Cartilage Scaffold Design

Miskon

Zaidi

2022

Materials

View full text Add to dashboard Cite

The existing harder biomaterial does not protect the tissue cells with blunt-force trauma effects, making it a poor choice for the articular cartilage scaffold design. Despite the traditional mechanical strengths, this study aims to discover alternative structural strengths for the scaffold supports. The metallic filler polymer reinforced method was used to fabricate the test specimen, either low brass (Cu80Zn20) or titanium dioxide filler, with composition weight percentages (wt.%) of 0, 2, 5, 15, and 30 in polyester urethane adhesive. The specimens were investigated for tensile, flexural, field emission scanning electron microscopy (FESEM), and X-ray diffraction (XRD) tests. The tensile and flexural test results increased with wt.%, but there were higher values for low brass filler specimens. The tensile strength curves were extended to discover an additional tensile strength occurring before 83% wt.%. The higher flexural stress was because of the Cu solvent and Zn solute substituting each other randomly. The FESEM micrograph showed a cubo-octahedron shaped structure that was similar to the AuCu3 structure class. The XRD pattern showed two prominent peaks of 2θ of 42.6° (110) and 49.7° (200) with d-spacings of 1.138 Å and 1.010 Å, respectively, that indicated the typical face-centred cubic superlattice structure with Cu and Zn atoms. Compared to the copper, zinc, and cart brass, the low brass indicated these superlattice structures had ordered–disordered transitional states. As a result, this additional strength was created by the superlattice structure and ordered–disordered transitional states. This innovative strength has the potential to develop into an anti-trauma biomaterial for osteoarthritic patients.

show abstract

Section: Superlattice Structure Analysismentioning

confidence: 82%

Structural Strength Analyses for Low Brass Filler Biomaterial with Anti-Trauma Effects in Articular Cartilage Scaffold Design

Miskon

Zaidi

2022

Materials

View full text Add to dashboard Cite

show abstract

“…To clarify this mechanism, the reversibility of the dissolution and deposition of Cu on the Pt electrode was conveniently evaluated in this experiment. It was found that the plots of current density (j / A cm -2 ) for Cu + /Cu 2+ species (anodic direction) and its reversible Cu 2+ /Cu + (cathodic direction) versus the square root of scan rate (V s -1 ) are linear in both systems, suggesting that the reactions are controlled by diffusion processes [51], as shown in Fig. 4b and d.…”

Section: Effects Of Scan Rate On the CV Of Cu With/without Nicotinic ...mentioning

confidence: 76%

Influence of different concentrations of nicotinic acid on the electrochemical fabrication of copper film from an ionic liquid based on the complexation of choline chloride-ethylene glycol

Ballantyne

Alesary

Ismail

et al. 2021

Journal of Electroanalytical Chemistry

View full text Add to dashboard Cite

“…Electrolyte compositions, including solvents, [17,18] Cu salts, [19] and additives [20] can have significant impact on Cu electrodeposition behavior, leading to different morphologies of Cu deposits. However, traditional and currently dominant copper electroplating electrolytes based on the copper cyanide type of aqueous solutions are environmentally unfriendly and biologically toxic; [21] while the non‐toxic copper sulfate type of aqueous solutions still suffers from poor dispersion and smoothness and low glossiness [22] . Therefore, developments of green and effective electrolytes for Cu deposition are urgent, for which fundamental investigations are indispensable.…”

Section: Introductionmentioning

confidence: 99%

Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**

Tan

Liu

et al. 2022

ChemElectroChem

View full text Add to dashboard Cite

Electrolyte composition can have significant influences on metal deposition. In this work we employ in‐situ scanning tunneling microscope (STM), together with electrochemical methods to investigate Cu deposition on Au (111) in ethaline containing CuCl2. Cyclic voltammograms in the Cu overpotential deposition regime are dominated by a rapidly rising cathodic current, accompanied by a preceding shoulder. Instantaneous nucleation and three‐dimensional growth are discerned for the Cu deposition at larger overpotential. In‐situ STM reveals the shoulder process is associated with the formation of monoatomic‐height clusters. Meanwhile, morphology evolutions of Cu nuclei along with time and potential are followed, and layered hexagonal and hexagon fortress shaped Cu nuclei and their growth are directly observed. Furthermore, atomic‐resolution imaging elucidates an ordered incommensurate (6×√79) adsorption structure on the surface of a Cu nucleus. Our observations are helpful in gaining deeper insights into the effect of deep eutectic solvents (DES) on Cu deposition at microscopic level.

show abstract

Mechanism study of Cu-Zn alloys electrodeposition in deep eutectic solvents

Cited by 50 publications

References 46 publications

Structural Strength Analyses for Low Brass Filler Biomaterial with Anti-Trauma Effects in Articular Cartilage Scaffold Design

Structural Strength Analyses for Low Brass Filler Biomaterial with Anti-Trauma Effects in Articular Cartilage Scaffold Design

Influence of different concentrations of nicotinic acid on the electrochemical fabrication of copper film from an ionic liquid based on the complexation of choline chloride-ethylene glycol

Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**

Contact Info

Product

Resources

About